Compared to the previous ones, this series is super straightforward
since it leverages all the core changes that have already been done for
the JV/RV families. Like the former JV/RV series, it first cleans up the
table for JW chips. As I have access to a lot of devices, I made test
runs with almost all of them. This way I could extract the SFDP data,
the capabilities of the chips, proof that they passed all the tests,
etc. I then add support for the PW parts, also showing a full test run
in each case.

Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
---
Miquel Raynal (25):
      mtd: spi-nor: winbond: W25Q32xW-Q/N: Enhance identification of the chips
      mtd: spi-nor: winbond: W25Q64xW-Q/N: Enhance identification of the chips
      mtd: spi-nor: winbond: W25Q32xW-Q/N: Fill locking information
      mtd: spi-nor: winbond: W25Q64xW-Q/N: Fill locking information
      mtd: spi-nor: winbond: W25Q128JW-Q/N: Fill locking information
      mtd: spi-nor: winbond: W25Q32JW-M: Fill locking information
      mtd: spi-nor: winbond: W25Q64JW-M: Fill locking information
      mtd: spi-nor: winbond: W25Q128JW-M: Fill locking information
      mtd: spi-nor: winbond: W25Q256JW-Q/N/M: Fill locking information
      mtd: spi-nor: winbond: W25Q32JW-Q/N: Add quad page program capability
      mtd: spi-nor: winbond: W25Q64JW-Q/N: Add quad page program capability
      mtd: spi-nor: winbond: W25Q128JW-Q/N: Add quad page program capability
      mtd: spi-nor: winbond: W25Q32JW-M: Add quad page program capability
      mtd: spi-nor: winbond: W25Q64JW-M: Add quad page program capability
      mtd: spi-nor: winbond: W25Q128JW-M: Add quad page program capability
      mtd: spi-nor: winbond: Prepare introduction of W25QxxPW-Q/N parts
      mtd: spi-nor: winbond: Add support for W25Q33PW-Q/N
      mtd: spi-nor: winbond: Add support for W25Q64PW-Q/N
      mtd: spi-nor: winbond: Add support for W25Q12PW-Q/N
      mtd: spi-nor: winbond: Add support for W25Q25PW-Q/N
      mtd: spi-nor: winbond: Prepare introduction of W25QxxPW-M parts
      mtd: spi-nor: winbond: Add support for W25Q33PW-M
      mtd: spi-nor: winbond: Add support for W25Q64PW-M
      mtd: spi-nor: winbond: Add support for W25Q12PW-M
      mtd: spi-nor: winbond: Add support for W25Q25PW-M

 drivers/mtd/spi-nor/winbond.c | 91 ++++++++++++++++++++++++++++++++++++-------
 1 file changed, 77 insertions(+), 14 deletions(-)
---
base-commit: 21373f9588a0df4fd2ad7bbd120b04fccfaf0677
change-id: 20260626-winbond-master-spi-nor-jw-cleanup-pw-addition-15ea35485698

Best regards,
-- 
Miquel Raynal <miquel.raynal@bootlin.com>

On Wed Sep 9, 2026 at 5:25 PM CEST, Miquel Raynal wrote:
> Compared to the previous ones, this series is super straightforward
> since it leverages all the core changes that have already been done for
> the JV/RV families. Like the former JV/RV series, it first cleans up the
> table for JW chips. As I have access to a lot of devices, I made test
> runs with almost all of them. This way I could extract the SFDP data,
> the capabilities of the chips, proof that they passed all the tests,
> etc. I then add support for the PW parts, also showing a full test run
> in each case.
>
> Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
> ---
> Miquel Raynal (25):
>       mtd: spi-nor: winbond: W25Q32xW-Q/N: Enhance identification of the chips
>       mtd: spi-nor: winbond: W25Q64xW-Q/N: Enhance identification of the chips
>       mtd: spi-nor: winbond: W25Q32xW-Q/N: Fill locking information
>       mtd: spi-nor: winbond: W25Q64xW-Q/N: Fill locking information
>       mtd: spi-nor: winbond: W25Q128JW-Q/N: Fill locking information
>       mtd: spi-nor: winbond: W25Q32JW-M: Fill locking information
>       mtd: spi-nor: winbond: W25Q64JW-M: Fill locking information
>       mtd: spi-nor: winbond: W25Q128JW-M: Fill locking information
>       mtd: spi-nor: winbond: W25Q256JW-Q/N/M: Fill locking information
>       mtd: spi-nor: winbond: W25Q32JW-Q/N: Add quad page program capability
>       mtd: spi-nor: winbond: W25Q64JW-Q/N: Add quad page program capability
>       mtd: spi-nor: winbond: W25Q128JW-Q/N: Add quad page program capability
>       mtd: spi-nor: winbond: W25Q32JW-M: Add quad page program capability
>       mtd: spi-nor: winbond: W25Q64JW-M: Add quad page program capability
>       mtd: spi-nor: winbond: W25Q128JW-M: Add quad page program capability
>       mtd: spi-nor: winbond: Prepare introduction of W25QxxPW-Q/N parts
>       mtd: spi-nor: winbond: Add support for W25Q33PW-Q/N
>       mtd: spi-nor: winbond: Add support for W25Q64PW-Q/N
>       mtd: spi-nor: winbond: Add support for W25Q12PW-Q/N
>       mtd: spi-nor: winbond: Add support for W25Q25PW-Q/N
>       mtd: spi-nor: winbond: Prepare introduction of W25QxxPW-M parts
>       mtd: spi-nor: winbond: Add support for W25Q33PW-M
>       mtd: spi-nor: winbond: Add support for W25Q64PW-M
>       mtd: spi-nor: winbond: Add support for W25Q12PW-M
>       mtd: spi-nor: winbond: Add support for W25Q25PW-M

I've just noticed, that neither lore nor my mail server received all
your mails and there are missing patches.

Could you please send a new v2?

That also means, I've haven't been able to review patches 2, 5, 14,
15, 17, 22, 23.

-michael

> I've just noticed, that neither lore nor my mail server received all
> your mails and there are missing patches.
>
> Could you please send a new v2?
>
> That also means, I've haven't been able to review patches 2, 5, 14,
> 15, 17, 22, 23.

Ah, yes, we've had quota issues recently. These have been (normally)
fixed now. Certain recipients have received everything, but not all. I
will respin a v2 with the comment fixed.

Thanks,
Miquèl