[PATCH v3 00/25] mtd: spi-nor: winbond: Cleanup JW family, add support for PW chips

Miquel Raynal posted 25 patches 3 days, 13 hours ago
drivers/mtd/spi-nor/winbond.c | 91 ++++++++++++++++++++++++++++++++++++-------
1 file changed, 77 insertions(+), 14 deletions(-)
[PATCH v3 00/25] mtd: spi-nor: winbond: Cleanup JW family, add support for PW chips
Posted by Miquel Raynal 3 days, 13 hours ago
Compared to the previous ones, this series is super straightforward
since it leverages all the core changes that have already been done for
the JV/RV families. Like the former JV/RV series, it first cleans up the
table for JW chips. As I have access to a lot of devices, I made test
runs with almost all of them. This way I could extract the SFDP data,
the capabilities of the chips, proof that they passed all the tests,
etc. I then add support for the PW parts, also showing a full test run
in each case.

Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
---
Changes in v3:
- The 33PW chips do not have ECC support. Now that this was properly
  explained in a comment, Sashiko raised that the commit logs were wrong
  because they were still mentioning the capability. Fix the commit
  logs.
- Link to v2: https://lore.kernel.org/r/20260920-winbond-master-spi-nor-jw-cleanup-pw-addition-v2-0-ab9c9688d071@bootlin.com

Changes in v2:
- Fix comment pointed out by Michael.
- Resend the series, hopefully all patches will go through this time.
- Link to v1: https://lore.kernel.org/r/20260909-winbond-master-spi-nor-jw-cleanup-pw-addition-v1-0-c1b20c39dd1f@bootlin.com

---
Miquel Raynal (25):
      mtd: spi-nor: winbond: W25Q32xW-Q/N: Enhance identification of the chips
      mtd: spi-nor: winbond: W25Q64xW-Q/N: Enhance identification of the chips
      mtd: spi-nor: winbond: W25Q32xW-Q/N: Fill locking information
      mtd: spi-nor: winbond: W25Q64xW-Q/N: Fill locking information
      mtd: spi-nor: winbond: W25Q128JW-Q/N: Fill locking information
      mtd: spi-nor: winbond: W25Q32JW-M: Fill locking information
      mtd: spi-nor: winbond: W25Q64JW-M: Fill locking information
      mtd: spi-nor: winbond: W25Q128JW-M: Fill locking information
      mtd: spi-nor: winbond: W25Q256JW-Q/N/M: Fill locking information
      mtd: spi-nor: winbond: W25Q32JW-Q/N: Add quad page program capability
      mtd: spi-nor: winbond: W25Q64JW-Q/N: Add quad page program capability
      mtd: spi-nor: winbond: W25Q128JW-Q/N: Add quad page program capability
      mtd: spi-nor: winbond: W25Q32JW-M: Add quad page program capability
      mtd: spi-nor: winbond: W25Q64JW-M: Add quad page program capability
      mtd: spi-nor: winbond: W25Q128JW-M: Add quad page program capability
      mtd: spi-nor: winbond: Prepare introduction of W25QxxPW-Q/N parts
      mtd: spi-nor: winbond: Add support for W25Q33PW-Q/N
      mtd: spi-nor: winbond: Add support for W25Q64PW-Q/N
      mtd: spi-nor: winbond: Add support for W25Q12PW-Q/N
      mtd: spi-nor: winbond: Add support for W25Q25PW-Q/N
      mtd: spi-nor: winbond: Prepare introduction of W25QxxPW-M parts
      mtd: spi-nor: winbond: Add support for W25Q33PW-M
      mtd: spi-nor: winbond: Add support for W25Q64PW-M
      mtd: spi-nor: winbond: Add support for W25Q12PW-M
      mtd: spi-nor: winbond: Add support for W25Q25PW-M

 drivers/mtd/spi-nor/winbond.c | 91 ++++++++++++++++++++++++++++++++++++-------
 1 file changed, 77 insertions(+), 14 deletions(-)
---
base-commit: 21373f9588a0df4fd2ad7bbd120b04fccfaf0677
change-id: 20260626-winbond-master-spi-nor-jw-cleanup-pw-addition-15ea35485698

Best regards,
-- 
Miquel Raynal <miquel.raynal@bootlin.com>
Re: [PATCH v3 00/25] mtd: spi-nor: winbond: Cleanup JW family, add support for PW chips
Posted by Michael Walle 3 days, 12 hours ago
On Mon, 21 Sep 2026 08:43:31 +0200, Miquel Raynal wrote:
> Compared to the previous ones, this series is super straightforward
> since it leverages all the core changes that have already been done for
> the JV/RV families. Like the former JV/RV series, it first cleans up the
> table for JW chips. As I have access to a lot of devices, I made test
> runs with almost all of them. This way I could extract the SFDP data,
> the capabilities of the chips, proof that they passed all the tests,
> etc. I then add support for the PW parts, also showing a full test run
> in each case.
> 
> [...]

Applied, thanks!

[01/25] mtd: spi-nor: winbond: W25Q32xW-Q/N: Enhance identification of the chips
        commit: b1c987abe26f6b8614888c93dfb088193eebcdcc
[02/25] mtd: spi-nor: winbond: W25Q64xW-Q/N: Enhance identification of the chips
        commit: 96601905963b030a82b9ba4b0df98d8681c6a002
[03/25] mtd: spi-nor: winbond: W25Q32xW-Q/N: Fill locking information
        commit: a0d9dedd3423efd069bad9f181cf69c7dda76464
[04/25] mtd: spi-nor: winbond: W25Q64xW-Q/N: Fill locking information
        commit: a13c9bf62caa62a4cb96d7b85394346cabb73496
[05/25] mtd: spi-nor: winbond: W25Q128JW-Q/N: Fill locking information
        commit: acaacdb1e75d7ebca7ffb1fa97f149b08ea0fd3e
[06/25] mtd: spi-nor: winbond: W25Q32JW-M: Fill locking information
        commit: f81793c87530d45e96c5a012fd35d87457328cd1
[07/25] mtd: spi-nor: winbond: W25Q64JW-M: Fill locking information
        commit: 6af98fcf79a5d86822d3863802ad063a7ad6ca7d
[08/25] mtd: spi-nor: winbond: W25Q128JW-M: Fill locking information
        commit: 9780e26196039d7a67c915409e22c87db6b721d3
[09/25] mtd: spi-nor: winbond: W25Q256JW-Q/N/M: Fill locking information
        commit: f5e252b178066ecf4efe5abf2b0438242199a1ea
[10/25] mtd: spi-nor: winbond: W25Q32JW-Q/N: Add quad page program capability
        commit: efb7901c6b4d039d4a9a995c0710517b7217cbf0
[11/25] mtd: spi-nor: winbond: W25Q64JW-Q/N: Add quad page program capability
        commit: 016d9512933789a5e23608cf0839288f894b73a1
[12/25] mtd: spi-nor: winbond: W25Q128JW-Q/N: Add quad page program capability
        commit: d83b5c1df429b5df707046fc6562c60432445b32
[13/25] mtd: spi-nor: winbond: W25Q32JW-M: Add quad page program capability
        commit: afdf4a8c316bba78d8e72a2e113c63427504ca85
[14/25] mtd: spi-nor: winbond: W25Q64JW-M: Add quad page program capability
        commit: 34d7f1f5f1aab0c7b08599f0b77611d79b1377a9
[15/25] mtd: spi-nor: winbond: W25Q128JW-M: Add quad page program capability
        commit: 3520931436ee2ac2720f097c856aea01541ded60
[16/25] mtd: spi-nor: winbond: Prepare introduction of W25QxxPW-Q/N parts
        commit: a95136c1c4756885e4d333c7968b716f9008ee99
[17/25] mtd: spi-nor: winbond: Add support for W25Q33PW-Q/N
        commit: 93a72776acb954814940af8b915e609e1b18893d
[18/25] mtd: spi-nor: winbond: Add support for W25Q64PW-Q/N
        commit: c0f1355cece2e2bd19d62a35ba1b66bd09e89bde
[19/25] mtd: spi-nor: winbond: Add support for W25Q12PW-Q/N
        commit: b8a959f55f9f1806865aa38304289d2abaceacf4
[20/25] mtd: spi-nor: winbond: Add support for W25Q25PW-Q/N
        commit: 136588c583adc2c73934bb0e89877fd1a8b91305
[21/25] mtd: spi-nor: winbond: Prepare introduction of W25QxxPW-M parts
        commit: b60627be8faf82b2c64d86c83c27c730423d0524
[22/25] mtd: spi-nor: winbond: Add support for W25Q33PW-M
        commit: 03613e40f15d704013f90b2405c4a3bc6b751207
[23/25] mtd: spi-nor: winbond: Add support for W25Q64PW-M
        commit: d96b00b230d0512844d0e9c9bc391cdc30ab653b
[24/25] mtd: spi-nor: winbond: Add support for W25Q12PW-M
        commit: 8df89f0fe8e8ecc345c5a9e3ce49e41139eb4a0c
[25/25] mtd: spi-nor: winbond: Add support for W25Q25PW-M
        commit: ceedf3193cac49ddb488518616587484093d66e4

Best regards,
-- 
Michael Walle <mwalle@kernel.org>