The cooling subnode of a remoteproc represents a client of the Thermal
Mitigation Device QMI service running on it. Each subnode of the cooling
node represents a single control exposed by the service.
Signed-off-by: Gaurav Kohli <gaurav.kohli@oss.qualcomm.com>
---
.../bindings/remoteproc/qcom,pas-common.yaml | 6 ++
.../bindings/thermal/qcom,qmi-cooling.yaml | 72 +++++++++++++++++++
2 files changed, 78 insertions(+)
create mode 100644 Documentation/devicetree/bindings/thermal/qcom,qmi-cooling.yaml
diff --git a/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml b/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml
index 68c17bf18987..6a736161d5ae 100644
--- a/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml
+++ b/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml
@@ -80,6 +80,12 @@ properties:
and devices related to the ADSP.
unevaluatedProperties: false
+ cooling:
+ $ref: /schemas/thermal/qcom,qmi-cooling.yaml#
+ description:
+ Cooling subnode which represents the cooling devices exposed by the Modem.
+ unevaluatedProperties: false
+
required:
- clocks
- clock-names
diff --git a/Documentation/devicetree/bindings/thermal/qcom,qmi-cooling.yaml b/Documentation/devicetree/bindings/thermal/qcom,qmi-cooling.yaml
new file mode 100644
index 000000000000..0dd3bd84c176
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/qcom,qmi-cooling.yaml
@@ -0,0 +1,72 @@
+# SPDX-License-Identifier: (GPL-2.0 OR BSD-2-Clause)
+
+%YAML 1.2
+---
+$id: http://devicetree.org/schemas/thermal/qcom,qmi-cooling.yaml#
+$schema: http://devicetree.org/meta-schemas/core.yaml#
+
+title: Qualcomm QMI based thermal mitigation (TMD) cooling devices
+
+maintainers:
+ - Gaurav Kohli <gaurav.kohli@oss.qualcomm.com>
+
+description:
+ Qualcomm QMI-based TMD cooling devices are used to mitigate thermal conditions
+ across multiple remote subsystems. These devices operate based on junction
+ temperature sensors (TSENS) associated with thermal zones for each subsystem.
+
+properties:
+ compatible:
+ enum:
+ - qcom,qmi-cooling-cdsp
+ - qcom,qmi-cooling-cdsp1
+
+patternProperties:
+ "cdsp-tmd[0-9]*$":
+ type: object
+
+ description:
+ Each subnode which represents qmi communication to CDSP.
+
+ properties:
+ label:
+ maxItems: 1
+
+ "#cooling-cells":
+ $ref: /schemas/thermal/thermal-cooling-devices.yaml#/properties/#cooling-cells
+
+ required:
+ - label
+ - "#cooling-cells"
+
+ additionalProperties: false
+
+required:
+ - compatible
+
+additionalProperties: false
+
+examples:
+ - |
+ remoteproc-cdsp {
+ cooling {
+ compatible = "qcom,qmi-cooling-cdsp";
+
+ cdsp_tmd0: cdsp-tmd0 {
+ label = "cdsp_sw";
+ #cooling-cells = <2>;
+ };
+ };
+ };
+
+ - |
+ remoteproc-cdsp1 {
+ cooling {
+ compatible = "qcom,qmi-cooling-cdsp1";
+
+ cdsp_tmd1: cdsp-tmd1 {
+ label = "cdsp_sw";
+ #cooling-cells = <2>;
+ };
+ };
+ };
--
2.34.1On Tue, Jan 27, 2026 at 09:27:16PM +0530, Gaurav Kohli wrote: > The cooling subnode of a remoteproc represents a client of the Thermal > Mitigation Device QMI service running on it. Each subnode of the cooling > node represents a single control exposed by the service. > > Signed-off-by: Gaurav Kohli <gaurav.kohli@oss.qualcomm.com> > --- > .../bindings/remoteproc/qcom,pas-common.yaml | 6 ++ > .../bindings/thermal/qcom,qmi-cooling.yaml | 72 +++++++++++++++++++ > 2 files changed, 78 insertions(+) > create mode 100644 Documentation/devicetree/bindings/thermal/qcom,qmi-cooling.yaml > > diff --git a/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml b/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml > index 68c17bf18987..6a736161d5ae 100644 > --- a/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml > +++ b/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml > @@ -80,6 +80,12 @@ properties: > and devices related to the ADSP. > unevaluatedProperties: false > > + cooling: > + $ref: /schemas/thermal/qcom,qmi-cooling.yaml# > + description: > + Cooling subnode which represents the cooling devices exposed by the Modem. > + unevaluatedProperties: false > + > required: > - clocks > - clock-names > diff --git a/Documentation/devicetree/bindings/thermal/qcom,qmi-cooling.yaml b/Documentation/devicetree/bindings/thermal/qcom,qmi-cooling.yaml > new file mode 100644 > index 000000000000..0dd3bd84c176 > --- /dev/null > +++ b/Documentation/devicetree/bindings/thermal/qcom,qmi-cooling.yaml > @@ -0,0 +1,72 @@ > +# SPDX-License-Identifier: (GPL-2.0 OR BSD-2-Clause) > + > +%YAML 1.2 > +--- > +$id: http://devicetree.org/schemas/thermal/qcom,qmi-cooling.yaml# > +$schema: http://devicetree.org/meta-schemas/core.yaml# > + > +title: Qualcomm QMI based thermal mitigation (TMD) cooling devices > + > +maintainers: > + - Gaurav Kohli <gaurav.kohli@oss.qualcomm.com> > + > +description: > + Qualcomm QMI-based TMD cooling devices are used to mitigate thermal conditions > + across multiple remote subsystems. These devices operate based on junction > + temperature sensors (TSENS) associated with thermal zones for each subsystem. > + > +properties: > + compatible: > + enum: > + - qcom,qmi-cooling-cdsp > + - qcom,qmi-cooling-cdsp1 If I read your schema as you've it written, then ADSP, SLPI and modem also can have _CDSP_ cooling device. Seems like an overkill. Please take care to describe cooling devices for all DSPs at once and describe them properly. -- With best wishes Dmitry
On 1/29/2026 6:15 AM, Dmitry Baryshkov wrote: > On Tue, Jan 27, 2026 at 09:27:16PM +0530, Gaurav Kohli wrote: >> The cooling subnode of a remoteproc represents a client of the Thermal >> Mitigation Device QMI service running on it. Each subnode of the cooling >> node represents a single control exposed by the service. >> >> Signed-off-by: Gaurav Kohli <gaurav.kohli@oss.qualcomm.com> >> --- >> .../bindings/remoteproc/qcom,pas-common.yaml | 6 ++ >> .../bindings/thermal/qcom,qmi-cooling.yaml | 72 +++++++++++++++++++ >> 2 files changed, 78 insertions(+) >> create mode 100644 Documentation/devicetree/bindings/thermal/qcom,qmi-cooling.yaml >> >> diff --git a/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml b/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml >> index 68c17bf18987..6a736161d5ae 100644 >> --- a/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml >> +++ b/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml >> @@ -80,6 +80,12 @@ properties: >> and devices related to the ADSP. >> unevaluatedProperties: false >> >> + cooling: >> + $ref: /schemas/thermal/qcom,qmi-cooling.yaml# >> + description: >> + Cooling subnode which represents the cooling devices exposed by the Modem. >> + unevaluatedProperties: false >> + >> required: >> - clocks >> - clock-names >> diff --git a/Documentation/devicetree/bindings/thermal/qcom,qmi-cooling.yaml b/Documentation/devicetree/bindings/thermal/qcom,qmi-cooling.yaml >> new file mode 100644 >> index 000000000000..0dd3bd84c176 >> --- /dev/null >> +++ b/Documentation/devicetree/bindings/thermal/qcom,qmi-cooling.yaml >> @@ -0,0 +1,72 @@ >> +# SPDX-License-Identifier: (GPL-2.0 OR BSD-2-Clause) >> + >> +%YAML 1.2 >> +--- >> +$id: http://devicetree.org/schemas/thermal/qcom,qmi-cooling.yaml# >> +$schema: http://devicetree.org/meta-schemas/core.yaml# >> + >> +title: Qualcomm QMI based thermal mitigation (TMD) cooling devices >> + >> +maintainers: >> + - Gaurav Kohli <gaurav.kohli@oss.qualcomm.com> >> + >> +description: >> + Qualcomm QMI-based TMD cooling devices are used to mitigate thermal conditions >> + across multiple remote subsystems. These devices operate based on junction >> + temperature sensors (TSENS) associated with thermal zones for each subsystem. >> + >> +properties: >> + compatible: >> + enum: >> + - qcom,qmi-cooling-cdsp >> + - qcom,qmi-cooling-cdsp1 > If I read your schema as you've it written, then ADSP, SLPI and modem > also can have _CDSP_ cooling device. Seems like an overkill. > > Please take care to describe cooling devices for all DSPs at once and > describe them properly. > Thanks for review. All the target supported in this series are limited to CDSP, so i will update the binding to describe only the CDSP.
On Fri, Jan 30, 2026 at 12:38:52PM +0530, Gaurav Kohli wrote: > > On 1/29/2026 6:15 AM, Dmitry Baryshkov wrote: > > On Tue, Jan 27, 2026 at 09:27:16PM +0530, Gaurav Kohli wrote: > > > The cooling subnode of a remoteproc represents a client of the Thermal > > > Mitigation Device QMI service running on it. Each subnode of the cooling > > > node represents a single control exposed by the service. > > > > > > Signed-off-by: Gaurav Kohli <gaurav.kohli@oss.qualcomm.com> > > > --- > > > .../bindings/remoteproc/qcom,pas-common.yaml | 6 ++ > > > .../bindings/thermal/qcom,qmi-cooling.yaml | 72 +++++++++++++++++++ > > > 2 files changed, 78 insertions(+) > > > create mode 100644 Documentation/devicetree/bindings/thermal/qcom,qmi-cooling.yaml > > > > > > diff --git a/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml b/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml > > > index 68c17bf18987..6a736161d5ae 100644 > > > --- a/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml > > > +++ b/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml > > > @@ -80,6 +80,12 @@ properties: > > > and devices related to the ADSP. > > > unevaluatedProperties: false > > > + cooling: > > > + $ref: /schemas/thermal/qcom,qmi-cooling.yaml# > > > + description: > > > + Cooling subnode which represents the cooling devices exposed by the Modem. > > > + unevaluatedProperties: false > > > + > > > required: > > > - clocks > > > - clock-names > > > diff --git a/Documentation/devicetree/bindings/thermal/qcom,qmi-cooling.yaml b/Documentation/devicetree/bindings/thermal/qcom,qmi-cooling.yaml > > > new file mode 100644 > > > index 000000000000..0dd3bd84c176 > > > --- /dev/null > > > +++ b/Documentation/devicetree/bindings/thermal/qcom,qmi-cooling.yaml > > > @@ -0,0 +1,72 @@ > > > +# SPDX-License-Identifier: (GPL-2.0 OR BSD-2-Clause) > > > + > > > +%YAML 1.2 > > > +--- > > > +$id: http://devicetree.org/schemas/thermal/qcom,qmi-cooling.yaml# > > > +$schema: http://devicetree.org/meta-schemas/core.yaml# > > > + > > > +title: Qualcomm QMI based thermal mitigation (TMD) cooling devices > > > + > > > +maintainers: > > > + - Gaurav Kohli <gaurav.kohli@oss.qualcomm.com> > > > + > > > +description: > > > + Qualcomm QMI-based TMD cooling devices are used to mitigate thermal conditions > > > + across multiple remote subsystems. These devices operate based on junction > > > + temperature sensors (TSENS) associated with thermal zones for each subsystem. > > > + > > > +properties: > > > + compatible: > > > + enum: > > > + - qcom,qmi-cooling-cdsp > > > + - qcom,qmi-cooling-cdsp1 > > If I read your schema as you've it written, then ADSP, SLPI and modem > > also can have _CDSP_ cooling device. Seems like an overkill. > > > > Please take care to describe cooling devices for all DSPs at once and > > describe them properly. > > > > Thanks for review. > > All the target supported in this series are limited to CDSP, so i will > update the binding to describe > > only the CDSP. Why are you limiting yourself to just CDSP? I don't think there is a significant difference between CDSP and other DSPs from the cooling point of view. BTW: could you please also fix your email editor, it inserts extra unneeded newline characters. > > -- With best wishes Dmitry
On Tue, Jan 27, 2026 at 09:27:16PM +0530, Gaurav Kohli wrote: > The cooling subnode of a remoteproc represents a client of the Thermal > Mitigation Device QMI service running on it. Each subnode of the cooling > node represents a single control exposed by the service. Subject - almost bingo, you hit two out of three which you should not use. A nit, subject: drop second/last, redundant "bindings yaml" and whatever else is duplicating. The "dt-bindings" prefix is already stating that these are bindings. See also: https://elixir.bootlin.com/linux/v6.17-rc3/source/Documentation/devicetree/bindings/submitting-patches.rst#L18 Best regards, Krzysztof
On 1/28/2026 4:58 PM, Krzysztof Kozlowski wrote: > On Tue, Jan 27, 2026 at 09:27:16PM +0530, Gaurav Kohli wrote: >> The cooling subnode of a remoteproc represents a client of the Thermal >> Mitigation Device QMI service running on it. Each subnode of the cooling >> node represents a single control exposed by the service. > Subject - almost bingo, you hit two out of three which you should not > use. > > A nit, subject: drop second/last, redundant "bindings yaml" and whatever > else is duplicating. The "dt-bindings" prefix is already stating that > these are bindings. > See also: > https://elixir.bootlin.com/linux/v6.17-rc3/source/Documentation/devicetree/bindings/submitting-patches.rst#L18 thanks for review Will update this. > > > Best regards, > Krzysztof >
On Tue, Jan 27, 2026 at 09:27:16PM +0530, Gaurav Kohli wrote:
> The cooling subnode of a remoteproc represents a client of the Thermal
> Mitigation Device QMI service running on it. Each subnode of the cooling
> node represents a single control exposed by the service.
>
> Signed-off-by: Gaurav Kohli <gaurav.kohli@oss.qualcomm.com>
> ---
> .../bindings/remoteproc/qcom,pas-common.yaml | 6 ++
> .../bindings/thermal/qcom,qmi-cooling.yaml | 72 +++++++++++++++++++
> 2 files changed, 78 insertions(+)
> create mode 100644 Documentation/devicetree/bindings/thermal/qcom,qmi-cooling.yaml
>
> diff --git a/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml b/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml
> index 68c17bf18987..6a736161d5ae 100644
> --- a/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml
> +++ b/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml
> @@ -80,6 +80,12 @@ properties:
> and devices related to the ADSP.
> unevaluatedProperties: false
>
> + cooling:
> + $ref: /schemas/thermal/qcom,qmi-cooling.yaml#
> + description:
> + Cooling subnode which represents the cooling devices exposed by the Modem.
I do not see the reason why you need 3 (!!!) children here. Everything
should be folded here.
> + unevaluatedProperties: false
> +
> required:
> - clocks
> - clock-names
> diff --git a/Documentation/devicetree/bindings/thermal/qcom,qmi-cooling.yaml b/Documentation/devicetree/bindings/thermal/qcom,qmi-cooling.yaml
> new file mode 100644
> index 000000000000..0dd3bd84c176
> --- /dev/null
> +++ b/Documentation/devicetree/bindings/thermal/qcom,qmi-cooling.yaml
> @@ -0,0 +1,72 @@
> +# SPDX-License-Identifier: (GPL-2.0 OR BSD-2-Clause)
> +
> +%YAML 1.2
> +---
> +$id: http://devicetree.org/schemas/thermal/qcom,qmi-cooling.yaml#
> +$schema: http://devicetree.org/meta-schemas/core.yaml#
> +
> +title: Qualcomm QMI based thermal mitigation (TMD) cooling devices
> +
> +maintainers:
> + - Gaurav Kohli <gaurav.kohli@oss.qualcomm.com>
> +
> +description:
> + Qualcomm QMI-based TMD cooling devices are used to mitigate thermal conditions
> + across multiple remote subsystems. These devices operate based on junction
> + temperature sensors (TSENS) associated with thermal zones for each subsystem.
> +
> +properties:
> + compatible:
> + enum:
> + - qcom,qmi-cooling-cdsp
> + - qcom,qmi-cooling-cdsp1
What are the differences between them?
Why these are not SoC specific?
> +
> +patternProperties:
> + "cdsp-tmd[0-9]*$":
> + type: object
No, you do not need childnode. See writing bindings (covers exactly this
case).
> +
> + description:
> + Each subnode which represents qmi communication to CDSP.
> +
> + properties:
> + label:
> + maxItems: 1
> +
> + "#cooling-cells":
> + $ref: /schemas/thermal/thermal-cooling-devices.yaml#/properties/#cooling-cells
> +
> + required:
> + - label
> + - "#cooling-cells"
> +
> + additionalProperties: false
> +
> +required:
> + - compatible
> +
> +additionalProperties: false
> +
> +examples:
> + - |
> + remoteproc-cdsp {
> + cooling {
> + compatible = "qcom,qmi-cooling-cdsp";
> +
> + cdsp_tmd0: cdsp-tmd0 {
> + label = "cdsp_sw";
> + #cooling-cells = <2>;
> + };
> + };
> + };
> +
> + - |
> + remoteproc-cdsp1 {
No, don't create unnecessary examples. Please read some slides from
earlier talks so you won't need 10 iterations.
Best regards,
Krzysztof
On 1/28/2026 4:57 PM, Krzysztof Kozlowski wrote:
> On Tue, Jan 27, 2026 at 09:27:16PM +0530, Gaurav Kohli wrote:
>> The cooling subnode of a remoteproc represents a client of the Thermal
>> Mitigation Device QMI service running on it. Each subnode of the cooling
>> node represents a single control exposed by the service.
>>
>> Signed-off-by: Gaurav Kohli <gaurav.kohli@oss.qualcomm.com>
>> ---
>> .../bindings/remoteproc/qcom,pas-common.yaml | 6 ++
>> .../bindings/thermal/qcom,qmi-cooling.yaml | 72 +++++++++++++++++++
>> 2 files changed, 78 insertions(+)
>> create mode 100644 Documentation/devicetree/bindings/thermal/qcom,qmi-cooling.yaml
>>
>> diff --git a/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml b/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml
>> index 68c17bf18987..6a736161d5ae 100644
>> --- a/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml
>> +++ b/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml
>> @@ -80,6 +80,12 @@ properties:
>> and devices related to the ADSP.
>> unevaluatedProperties: false
>>
>> + cooling:
>> + $ref: /schemas/thermal/qcom,qmi-cooling.yaml#
>> + description:
>> + Cooling subnode which represents the cooling devices exposed by the Modem.
> I do not see the reason why you need 3 (!!!) children here. Everything
> should be folded here.
Thanks Krzysztof for review.
Each subsystem may support multiple thermal mitigation devices through
remote TMD service.
Because of this multiplicity, introduced separate binding file.
>> + unevaluatedProperties: false
>> +
>> required:
>> - clocks
>> - clock-names
>> diff --git a/Documentation/devicetree/bindings/thermal/qcom,qmi-cooling.yaml b/Documentation/devicetree/bindings/thermal/qcom,qmi-cooling.yaml
>> new file mode 100644
>> index 000000000000..0dd3bd84c176
>> --- /dev/null
>> +++ b/Documentation/devicetree/bindings/thermal/qcom,qmi-cooling.yaml
>> @@ -0,0 +1,72 @@
>> +# SPDX-License-Identifier: (GPL-2.0 OR BSD-2-Clause)
>> +
>> +%YAML 1.2
>> +---
>> +$id: http://devicetree.org/schemas/thermal/qcom,qmi-cooling.yaml#
>> +$schema: http://devicetree.org/meta-schemas/core.yaml#
>> +
>> +title: Qualcomm QMI based thermal mitigation (TMD) cooling devices
>> +
>> +maintainers:
>> + - Gaurav Kohli <gaurav.kohli@oss.qualcomm.com>
>> +
>> +description:
>> + Qualcomm QMI-based TMD cooling devices are used to mitigate thermal conditions
>> + across multiple remote subsystems. These devices operate based on junction
>> + temperature sensors (TSENS) associated with thermal zones for each subsystem.
>> +
>> +properties:
>> + compatible:
>> + enum:
>> + - qcom,qmi-cooling-cdsp
>> + - qcom,qmi-cooling-cdsp1
> What are the differences between them?
Some SOcs support multiple CDSP/NSP instances. Each instance requires
it's own
compatible string to distinguish.
> Why these are not SoC specific?
They are not soc specific because the qmi thermal mitigation interface
exposed by CDSP is architecturally
identical across multiple SOCS.
>> +
>> +patternProperties:
>> + "cdsp-tmd[0-9]*$":
>> + type: object
> No, you do not need childnode. See writing bindings (covers exactly this
> case).
Each subsystem may support multiple thermal mitigation devices through
remote TMD service. So
need childnode to distinguish for different mitigations.
>
>> +
>> + description:
>> + Each subnode which represents qmi communication to CDSP.
>> +
>> + properties:
>> + label:
>> + maxItems: 1
>> +
>> + "#cooling-cells":
>> + $ref: /schemas/thermal/thermal-cooling-devices.yaml#/properties/#cooling-cells
>> +
>> + required:
>> + - label
>> + - "#cooling-cells"
>> +
>> + additionalProperties: false
>> +
>> +required:
>> + - compatible
>> +
>> +additionalProperties: false
>> +
>> +examples:
>> + - |
>> + remoteproc-cdsp {
>> + cooling {
>> + compatible = "qcom,qmi-cooling-cdsp";
>> +
>> + cdsp_tmd0: cdsp-tmd0 {
>> + label = "cdsp_sw";
>> + #cooling-cells = <2>;
>> + };
>> + };
>> + };
>> +
>> + - |
>> + remoteproc-cdsp1 {
> No, don't create unnecessary examples. Please read some slides from
> earlier talks so you won't need 10 iterations.
Sure, will update this.
> Best regards,
> Krzysztof
>
On 29/01/2026 13:06, Gaurav Kohli wrote: > > On 1/28/2026 4:57 PM, Krzysztof Kozlowski wrote: >> On Tue, Jan 27, 2026 at 09:27:16PM +0530, Gaurav Kohli wrote: >>> The cooling subnode of a remoteproc represents a client of the Thermal >>> Mitigation Device QMI service running on it. Each subnode of the cooling >>> node represents a single control exposed by the service. >>> >>> Signed-off-by: Gaurav Kohli <gaurav.kohli@oss.qualcomm.com> >>> --- >>> .../bindings/remoteproc/qcom,pas-common.yaml | 6 ++ >>> .../bindings/thermal/qcom,qmi-cooling.yaml | 72 +++++++++++++++++++ >>> 2 files changed, 78 insertions(+) >>> create mode 100644 Documentation/devicetree/bindings/thermal/qcom,qmi-cooling.yaml >>> >>> diff --git a/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml b/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml >>> index 68c17bf18987..6a736161d5ae 100644 >>> --- a/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml >>> +++ b/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml >>> @@ -80,6 +80,12 @@ properties: >>> and devices related to the ADSP. >>> unevaluatedProperties: false >>> >>> + cooling: >>> + $ref: /schemas/thermal/qcom,qmi-cooling.yaml# >>> + description: >>> + Cooling subnode which represents the cooling devices exposed by the Modem. >> I do not see the reason why you need 3 (!!!) children here. Everything >> should be folded here. > > > Thanks Krzysztof for review. > > Each subsystem may support multiple thermal mitigation devices through > remote TMD service. > > Because of this multiplicity, introduced separate binding file. This explains nothing. Subsystem does not matter for the binding. My comment stays. > >>> + unevaluatedProperties: false >>> + >>> required: >>> - clocks >>> - clock-names >>> diff --git a/Documentation/devicetree/bindings/thermal/qcom,qmi-cooling.yaml b/Documentation/devicetree/bindings/thermal/qcom,qmi-cooling.yaml >>> new file mode 100644 >>> index 000000000000..0dd3bd84c176 >>> --- /dev/null >>> +++ b/Documentation/devicetree/bindings/thermal/qcom,qmi-cooling.yaml >>> @@ -0,0 +1,72 @@ >>> +# SPDX-License-Identifier: (GPL-2.0 OR BSD-2-Clause) >>> + >>> +%YAML 1.2 >>> +--- >>> +$id: http://devicetree.org/schemas/thermal/qcom,qmi-cooling.yaml# >>> +$schema: http://devicetree.org/meta-schemas/core.yaml# >>> + >>> +title: Qualcomm QMI based thermal mitigation (TMD) cooling devices >>> + >>> +maintainers: >>> + - Gaurav Kohli <gaurav.kohli@oss.qualcomm.com> >>> + >>> +description: >>> + Qualcomm QMI-based TMD cooling devices are used to mitigate thermal conditions >>> + across multiple remote subsystems. These devices operate based on junction >>> + temperature sensors (TSENS) associated with thermal zones for each subsystem. >>> + >>> +properties: >>> + compatible: >>> + enum: >>> + - qcom,qmi-cooling-cdsp >>> + - qcom,qmi-cooling-cdsp1 >> What are the differences between them? > > > Some SOcs support multiple CDSP/NSP instances. Each instance requires > it's own > > compatible string to distinguish. Why? What are the differences? I will not ask third time, but just respond with NAK. > > >> Why these are not SoC specific? > > > They are not soc specific because the qmi thermal mitigation interface > exposed by CDSP is architecturally > > identical across multiple SOCS. I have doubts on that but anyway if you want exception from standard compatible rules you must come with arguments in terms of hardware and firmware. Above is not enough. Everyone claims that. > > >>> + >>> +patternProperties: >>> + "cdsp-tmd[0-9]*$": >>> + type: object >> No, you do not need childnode. See writing bindings (covers exactly this >> case). > > > Each subsystem may support multiple thermal mitigation devices through > remote TMD service. So > > need childnode to distinguish for different mitigations. NAK Best regards, Krzysztof
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