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charset="utf-8" The cooling subnode of a remoteproc represents a client of the Thermal Mitigation Device QMI service running on it. Each subnode of the cooling node represents a single control exposed by the service. Signed-off-by: Gaurav Kohli --- .../bindings/remoteproc/qcom,pas-common.yaml | 6 ++ .../bindings/thermal/qcom,qmi-cooling.yaml | 72 +++++++++++++++++++ 2 files changed, 78 insertions(+) create mode 100644 Documentation/devicetree/bindings/thermal/qcom,qmi-cool= ing.yaml diff --git a/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.y= aml b/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml index 68c17bf18987..6a736161d5ae 100644 --- a/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml +++ b/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml @@ -80,6 +80,12 @@ properties: and devices related to the ADSP. unevaluatedProperties: false =20 + cooling: + $ref: /schemas/thermal/qcom,qmi-cooling.yaml# + description: + Cooling subnode which represents the cooling devices exposed by the = Modem. + unevaluatedProperties: false + required: - clocks - clock-names diff --git a/Documentation/devicetree/bindings/thermal/qcom,qmi-cooling.yam= l b/Documentation/devicetree/bindings/thermal/qcom,qmi-cooling.yaml new file mode 100644 index 000000000000..0dd3bd84c176 --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/qcom,qmi-cooling.yaml @@ -0,0 +1,72 @@ +# SPDX-License-Identifier: (GPL-2.0 OR BSD-2-Clause) + +%YAML 1.2 +--- +$id: http://devicetree.org/schemas/thermal/qcom,qmi-cooling.yaml# +$schema: http://devicetree.org/meta-schemas/core.yaml# + +title: Qualcomm QMI based thermal mitigation (TMD) cooling devices + +maintainers: + - Gaurav Kohli + +description: + Qualcomm QMI-based TMD cooling devices are used to mitigate thermal cond= itions + across multiple remote subsystems. These devices operate based on juncti= on + temperature sensors (TSENS) associated with thermal zones for each subsy= stem. + +properties: + compatible: + enum: + - qcom,qmi-cooling-cdsp + - qcom,qmi-cooling-cdsp1 + +patternProperties: + "cdsp-tmd[0-9]*$": + type: object + + description: + Each subnode which represents qmi communication to CDSP. + + properties: + label: + maxItems: 1 + + "#cooling-cells": + $ref: /schemas/thermal/thermal-cooling-devices.yaml#/properties/#c= ooling-cells + + required: + - label + - "#cooling-cells" + + additionalProperties: false + +required: + - compatible + +additionalProperties: false + +examples: + - | + remoteproc-cdsp { + cooling { + compatible =3D "qcom,qmi-cooling-cdsp"; + + cdsp_tmd0: cdsp-tmd0 { + label =3D "cdsp_sw"; + #cooling-cells =3D <2>; + }; + }; + }; + + - | + remoteproc-cdsp1 { + cooling { + compatible =3D "qcom,qmi-cooling-cdsp1"; + + cdsp_tmd1: cdsp-tmd1 { + label =3D "cdsp_sw"; + #cooling-cells =3D <2>; + }; + }; + }; --=20 2.34.1