Add devicetree binding document for TMP006, IR thermopile sensor.

Signed-off-by: Anup Sharma <anupnewsmail@gmail.com>

Changes:
V1 -> V2: Removed redundant dt-binding from subject.
          Added supply information.
          Adhere to the generic node name.
---
 .../bindings/iio/temperature/ti,tmp006.yaml   | 42 +++++++++++++++++++
 1 file changed, 42 insertions(+)
 create mode 100644 Documentation/devicetree/bindings/iio/temperature/ti,tmp006.yaml

diff --git a/Documentation/devicetree/bindings/iio/temperature/ti,tmp006.yaml b/Documentation/devicetree/bindings/iio/temperature/ti,tmp006.yaml
new file mode 100644
index 000000000000..4915c3e2d721
--- /dev/null
+++ b/Documentation/devicetree/bindings/iio/temperature/ti,tmp006.yaml
@@ -0,0 +1,42 @@
+# SPDX-License-Identifier: (GPL-2.0 OR BSD-2-Clause)
+%YAML 1.2
+---
+$id: http://devicetree.org/schemas/iio/temperature/ti,tmp006.yaml#
+$schema: http://devicetree.org/meta-schemas/core.yaml#
+
+title: TI TMP006 IR thermopile sensor
+
+maintainers:
+  - Peter Meerwald <pmeerw@pmeerw.net>
+
+description: |
+  TI TMP006 - Infrared Thermopile Sensor in Chip-Scale Package.
+  https://cdn.sparkfun.com/datasheets/Sensors/Temp/tmp006.pdf
+
+properties:
+  compatible:
+    const: ti,tmp006
+
+  reg:
+    maxItems: 1
+
+  vdd-supply:
+    description: provide VDD power to the sensor.
+
+required:
+  - compatible
+  - reg
+
+additionalProperties: false
+
+examples:
+  - |
+    i2c {
+        #address-cells = <1>;
+        #size-cells = <0>;
+        temperature-sensor@40 {
+            compatible = "ti,tmp006";
+            reg = <0x40>;
+            vdd-supply = <&ldo4_reg>
+        };
+    };
-- 
2.34.1

On Mon, 15 May 2023 00:31:59 +0530, Anup Sharma wrote:
> Add devicetree binding document for TMP006, IR thermopile sensor.
> 
> Signed-off-by: Anup Sharma <anupnewsmail@gmail.com>
> 
> Changes:
> V1 -> V2: Removed redundant dt-binding from subject.
>           Added supply information.
>           Adhere to the generic node name.
> ---
>  .../bindings/iio/temperature/ti,tmp006.yaml   | 42 +++++++++++++++++++
>  1 file changed, 42 insertions(+)
>  create mode 100644 Documentation/devicetree/bindings/iio/temperature/ti,tmp006.yaml
> 

My bot found errors running 'make DT_CHECKER_FLAGS=-m dt_binding_check'
on your patch (DT_CHECKER_FLAGS is new in v5.13):

yamllint warnings/errors:

dtschema/dtc warnings/errors:
Error: Documentation/devicetree/bindings/iio/temperature/ti,tmp006.example.dts:25.13-14 syntax error
FATAL ERROR: Unable to parse input tree
make[1]: *** [scripts/Makefile.lib:419: Documentation/devicetree/bindings/iio/temperature/ti,tmp006.example.dtb] Error 1
make[1]: *** Waiting for unfinished jobs....
make: *** [Makefile:1512: dt_binding_check] Error 2

See https://patchwork.ozlabs.org/patch/1781058

This check can fail if there are any dependencies. The base for a patch
series is generally the most recent rc1.

If you already ran 'make dt_binding_check' and didn't see the above
error(s), then make sure 'yamllint' is installed and dt-schema is up to
date:

pip3 install dtschema --upgrade

Please check and re-submit.

On 14/05/2023 21:01, Anup Sharma wrote:
> Add devicetree binding document for TMP006, IR thermopile sensor.
> 
> Signed-off-by: Anup Sharma <anupnewsmail@gmail.com>
> 

Missing ---


> Changes:
> V1 -> V2: Removed redundant dt-binding from subject.
>           Added supply information.
>           Adhere to the generic node name.
> ---


Best regards,
Krzysztof