Commit ebf1d03dab96 ("iio: inkern: Use namespaced exports") in the iio
tree restricts certain exported core functions that a driver added in
commit c3dce117333c ("thermal/drivers/qcom: Add support for Qualcomm MBG
thermal monitoring") from the thermal tree uses, causing modpost to
warn (or error without CONFIG_MODULE_ALLOW_MISSING_NAMESPACE_IMPORTS):

  ERROR: modpost: drivers/thermal/qcom/qcom-spmi-mbg-tm.ko: module uses symbol 'devm_iio_channel_get' from namespace 'IIO_CONSUMER', but does not import it.
  ERROR: modpost: drivers/thermal/qcom/qcom-spmi-mbg-tm.ko: module uses symbol 'iio_read_channel_processed' from namespace 'IIO_CONSUMER', but does not import it.

Add the IIO_CONSUMER namespace import to clear up the error.

Signed-off-by: Nathan Chancellor <nathan@kernel.org>
---
I am not sure how this should be handled. As far as I can tell, there is
no error if this patch is applied to the thermal tree directly but it
would leave an "orphaned" module namespace import until the iio and
thermal trees are combined, which may not be preferable. Otherwise, it
would need to be applied to whatever merge happens second (hence
including Mark and Jonathan in this conversation).
---
 drivers/thermal/qcom/qcom-spmi-mbg-tm.c | 1 +
 1 file changed, 1 insertion(+)

diff --git a/drivers/thermal/qcom/qcom-spmi-mbg-tm.c b/drivers/thermal/qcom/qcom-spmi-mbg-tm.c
index 0492d5eeca01..a05bb444627a 100644
--- a/drivers/thermal/qcom/qcom-spmi-mbg-tm.c
+++ b/drivers/thermal/qcom/qcom-spmi-mbg-tm.c
@@ -254,3 +254,4 @@ module_platform_driver(mbg_tm_driver);
 
 MODULE_DESCRIPTION("PMIC MBG Temperature monitor driver");
 MODULE_LICENSE("GPL");
+MODULE_IMPORT_NS("IIO_CONSUMER");

---
base-commit: 28d012efb4327f9c75d5e042a7c91e9a542efa98
change-id: 20260812-qcom-spmi-mbg-tm-ns-modpost-error-fad8be2f985c

Best regards,
--  
Cheers,
Nathan

On Wed, 12 Aug 2026 18:17:22 -0700
Nathan Chancellor <nathan@kernel.org> wrote:

> Commit ebf1d03dab96 ("iio: inkern: Use namespaced exports") in the iio
> tree restricts certain exported core functions that a driver added in
> commit c3dce117333c ("thermal/drivers/qcom: Add support for Qualcomm MBG
> thermal monitoring") from the thermal tree uses, causing modpost to
> warn (or error without CONFIG_MODULE_ALLOW_MISSING_NAMESPACE_IMPORTS):
> 
>   ERROR: modpost: drivers/thermal/qcom/qcom-spmi-mbg-tm.ko: module uses symbol 'devm_iio_channel_get' from namespace 'IIO_CONSUMER', but does not import it.
>   ERROR: modpost: drivers/thermal/qcom/qcom-spmi-mbg-tm.ko: module uses symbol 'iio_read_channel_processed' from namespace 'IIO_CONSUMER', but does not import it.
> 
> Add the IIO_CONSUMER namespace import to clear up the error.
> 
> Signed-off-by: Nathan Chancellor <nathan@kernel.org>

Ah. I'd forgotten we had the namespace addition earlier this cycle.
Too much going on at the moment :(

Sorry about that - I should have given you a heads up.  Another
win for linux-next testing things!

> ---
> I am not sure how this should be handled. As far as I can tell, there is
> no error if this patch is applied to the thermal tree directly but it
> would leave an "orphaned" module namespace import until the iio and
> thermal trees are combined, which may not be preferable. Otherwise, it
> would need to be applied to whatever merge happens second (hence
> including Mark and Jonathan in this conversation).

I did plan for this being a possible issue:

Ideal is merge 
https://git.kernel.org/pub/scm/linux/kernel/git/jic23/iio.git #iio-inkern-namespace-ib
to the thermal tree.  If I'd called that out originally (or a thermal
rebase is a possibility) it would be cleaner to do this before the
qcom patch adds another user then squash what you have here in the appropriate
patch.  Alternative is do it as a merge conflict resolution whilst merging
in that tree.  If the second, I'd also mention that in the thermal pull request to
Linus given it's a little unusual.

Jonathan

> ---
>  drivers/thermal/qcom/qcom-spmi-mbg-tm.c | 1 +
>  1 file changed, 1 insertion(+)
> 
> diff --git a/drivers/thermal/qcom/qcom-spmi-mbg-tm.c b/drivers/thermal/qcom/qcom-spmi-mbg-tm.c
> index 0492d5eeca01..a05bb444627a 100644
> --- a/drivers/thermal/qcom/qcom-spmi-mbg-tm.c
> +++ b/drivers/thermal/qcom/qcom-spmi-mbg-tm.c
> @@ -254,3 +254,4 @@ module_platform_driver(mbg_tm_driver);
>  
>  MODULE_DESCRIPTION("PMIC MBG Temperature monitor driver");
>  MODULE_LICENSE("GPL");
> +MODULE_IMPORT_NS("IIO_CONSUMER");
> 
> ---
> base-commit: 28d012efb4327f9c75d5e042a7c91e9a542efa98
> change-id: 20260812-qcom-spmi-mbg-tm-ns-modpost-error-fad8be2f985c
> 
> Best regards,
> --  
> Cheers,
> Nathan
>

On Thu, Aug 13, 2026 at 02:35:43AM +0100, Jonathan Cameron wrote:
> I did plan for this being a possible issue:
> 
> Ideal is merge 
> https://git.kernel.org/pub/scm/linux/kernel/git/jic23/iio.git #iio-inkern-namespace-ib
> to the thermal tree.  If I'd called that out originally (or a thermal
> rebase is a possibility) it would be cleaner to do this before the
> qcom patch adds another user then squash what you have here in the appropriate
> patch.  Alternative is do it as a merge conflict resolution whilst merging
> in that tree.  If the second, I'd also mention that in the thermal pull request to
> Linus given it's a little unusual.

Ah, I did not realize that you had a stable branch with the module
namespace patch. Merging that in then applying this to the thermal tree
seems like the best course of action. If rebasing is possible, I do not
mind this patch being squashed into the original.

-- 
Cheers,
Nathan

Hello,

On Thu, Aug 13, 2026 at 05:05:05PM -0700, Nathan Chancellor wrote:
> On Thu, Aug 13, 2026 at 02:35:43AM +0100, Jonathan Cameron wrote:
> > I did plan for this being a possible issue:
> > 
> > Ideal is merge 
> > https://git.kernel.org/pub/scm/linux/kernel/git/jic23/iio.git #iio-inkern-namespace-ib
> > to the thermal tree.  If I'd called that out originally (or a thermal
> > rebase is a possibility) it would be cleaner to do this before the
> > qcom patch adds another user then squash what you have here in the appropriate
> > patch.  Alternative is do it as a merge conflict resolution whilst merging
> > in that tree.  If the second, I'd also mention that in the thermal pull request to
> > Linus given it's a little unusual.
> 
> Ah, I did not realize that you had a stable branch with the module
> namespace patch. Merging that in then applying this to the thermal tree
> seems like the best course of action. If rebasing is possible, I do not
> mind this patch being squashed into the original.

FTR, this issue is still present as of next-20260820. Assuming that
c3dce117333c ("thermal/drivers/qcom: Add support for Qualcomm MBG
thermal monitoring") is supposed to go into v7.3-rc1, it would be
awesome to address this before the commit hits Linus' tree.

Best regards
Uwe

Le 21/08/2026 à 12:29, Uwe Kleine-König a écrit :
> Hello,
> 
> On Thu, Aug 13, 2026 at 05:05:05PM -0700, Nathan Chancellor wrote:
>> On Thu, Aug 13, 2026 at 02:35:43AM +0100, Jonathan Cameron wrote:
>>> I did plan for this being a possible issue:
>>>
>>> Ideal is merge
>>> https://git.kernel.org/pub/scm/linux/kernel/git/jic23/iio.git #iio-inkern-namespace-ib
>>> to the thermal tree.  If I'd called that out originally (or a thermal
>>> rebase is a possibility) it would be cleaner to do this before the
>>> qcom patch adds another user then squash what you have here in the appropriate
>>> patch.  Alternative is do it as a merge conflict resolution whilst merging
>>> in that tree.  If the second, I'd also mention that in the thermal pull request to
>>> Linus given it's a little unusual.
>>
>> Ah, I did not realize that you had a stable branch with the module
>> namespace patch. Merging that in then applying this to the thermal tree
>> seems like the best course of action. If rebasing is possible, I do not
>> mind this patch being squashed into the original.
> 
> FTR, this issue is still present as of next-20260820. Assuming that
> c3dce117333c ("thermal/drivers/qcom: Add support for Qualcomm MBG
> thermal monitoring") is supposed to go into v7.3-rc1, it would be
> awesome to address this before the commit hits Linus' tree.
Rafael ? Do you want to pick it up directly in linux-pm/thermal ?

On Fri, Aug 21, 2026 at 12:40 PM Daniel Lezcano
<daniel.lezcano@oss.qualcomm.com> wrote:
>
> Le 21/08/2026 à 12:29, Uwe Kleine-König a écrit :
> > Hello,
> >
> > On Thu, Aug 13, 2026 at 05:05:05PM -0700, Nathan Chancellor wrote:
> >> On Thu, Aug 13, 2026 at 02:35:43AM +0100, Jonathan Cameron wrote:
> >>> I did plan for this being a possible issue:
> >>>
> >>> Ideal is merge
> >>> https://git.kernel.org/pub/scm/linux/kernel/git/jic23/iio.git #iio-inkern-namespace-ib
> >>> to the thermal tree.  If I'd called that out originally (or a thermal
> >>> rebase is a possibility) it would be cleaner to do this before the
> >>> qcom patch adds another user then squash what you have here in the appropriate
> >>> patch.  Alternative is do it as a merge conflict resolution whilst merging
> >>> in that tree.  If the second, I'd also mention that in the thermal pull request to
> >>> Linus given it's a little unusual.
> >>
> >> Ah, I did not realize that you had a stable branch with the module
> >> namespace patch. Merging that in then applying this to the thermal tree
> >> seems like the best course of action. If rebasing is possible, I do not
> >> mind this patch being squashed into the original.
> >
> > FTR, this issue is still present as of next-20260820. Assuming that
> > c3dce117333c ("thermal/drivers/qcom: Add support for Qualcomm MBG
> > thermal monitoring") is supposed to go into v7.3-rc1, it would be
> > awesome to address this before the commit hits Linus' tree.
> Rafael ? Do you want to pick it up directly in linux-pm/thermal ?

Yes, I will apply it directly, thanks!