[PATCH v1 2/4] dt-bindings: arm: ti: Add binding for AM625 SiP

Anshul Dalal posted 4 patches 1 month, 3 weeks ago
[PATCH v1 2/4] dt-bindings: arm: ti: Add binding for AM625 SiP
Posted by Anshul Dalal 1 month, 3 weeks ago
The AM6254atl SiP belongs to the K3 Multicore SoC architecture platform,
providing AM625 SoC with 512MiB of integrated DDR in the package.

For further information about the package check:
https://www.ti.com/lit/ds/symlink/am625sip.pdf

Signed-off-by: Anshul Dalal <anshuld@ti.com>
---
 Documentation/devicetree/bindings/arm/ti/k3.yaml | 7 +++++++
 1 file changed, 7 insertions(+)

diff --git a/Documentation/devicetree/bindings/arm/ti/k3.yaml b/Documentation/devicetree/bindings/arm/ti/k3.yaml
index e80c653fa438..f98817e97d4c 100644
--- a/Documentation/devicetree/bindings/arm/ti/k3.yaml
+++ b/Documentation/devicetree/bindings/arm/ti/k3.yaml
@@ -58,6 +58,13 @@ properties:
               - ti,am62-lp-sk
           - const: ti,am625
 
+      - description: K3 AM6254atl SiP
+        items:
+          - enum:
+              - ti,am6254atl-sk
+          - const: ti,am6254atl
+          - const: ti,am625
+
       - description: K3 AM62x SoC Toradex Verdin Modules and Carrier Boards
         items:
           - enum:
-- 
2.50.1
Re: [PATCH v1 2/4] dt-bindings: arm: ti: Add binding for AM625 SiP
Posted by Conor Dooley 1 month, 2 weeks ago
On Thu, Aug 14, 2025 at 07:15:28PM +0530, Anshul Dalal wrote:
> The AM6254atl SiP belongs to the K3 Multicore SoC architecture platform,
> providing AM625 SoC with 512MiB of integrated DDR in the package.
> 
> For further information about the package check:
> https://www.ti.com/lit/ds/symlink/am625sip.pdf
> 
> Signed-off-by: Anshul Dalal <anshuld@ti.com>

Acked-by: Conor Dooley <conor.dooley@microchip.com>