The AM62D2 SoC belongs to the K3 Multicore SoC architecture with DSP core
targeted for applications needing high-performance Digital Signal
Processing. It is used in applications like automotive audio systems,
professional sound equipment, radar and radio for aerospace, sonar in
marine devices, and ultrasound in medical imaging. It also supports
precise signal analysis in test and measurement tools.

Some highlights of AM62D2 SoC are:

* Quad-Cortex-A53s (running up to 1.4GHz) in a single cluster.
  Dual/Single core variants are provided in the same package to allow
  HW compatible designs.
* One Device manager Cortex-R5F for system power and resource management,
  and one Cortex-R5F for Functional Safety or general-purpose usage.
* DSP with Matrix Multiplication Accelerator(MMA) (up to 2 TOPS) based on
  single core C7x.
* 3x Multichannel Audio Serial Ports (McASP) Up to 4/6/16 Serial Data Pins
  which can Transmit and Receive Clocks up to 50MHz, with multi-channel I2S
  and TDM Audio inputs and outputs.
* Integrated Giga-bit Ethernet switch supporting up to a total of two
  external ports with TSN capable to enable audio networking features such
  as, Ethernet Audio Video Bridging (eAVB) and Dante.
* 9xUARTs, 5xSPI, 6xI2C, 2xUSB2, 3xCAN-FD, 3x eMMC and SD, OSPI memory
  controller, 1x CSI-RX-4L for Camera, eCAP/eQEP, ePWM, among other
  peripherals.
* Dedicated Centralized Hardware Security Module with support for secure
  boot, debug security and crypto acceleration and trusted execution
  environment.
* One 32 bit DDR Subsystem that supports LPDDR4, DDR4 memory types.
* Low power mode support: Partial IO support for CAN/GPIO/UART wakeup.

This adds dt bindings for TI's AM62D2 family of devices.

More details about the SoCs can be found in the Technical Reference Manual:
https://www.ti.com/lit/pdf/sprujd4

Signed-off-by: Paresh Bhagat <p-bhagat@ti.com>
---
 Documentation/devicetree/bindings/arm/ti/k3.yaml | 6 ++++++
 1 file changed, 6 insertions(+)

diff --git a/Documentation/devicetree/bindings/arm/ti/k3.yaml b/Documentation/devicetree/bindings/arm/ti/k3.yaml
index 18f155cd06c8..3183089dcfbf 100644
--- a/Documentation/devicetree/bindings/arm/ti/k3.yaml
+++ b/Documentation/devicetree/bindings/arm/ti/k3.yaml
@@ -31,6 +31,12 @@ properties:
           - const: phytec,am62a-phycore-som
           - const: ti,am62a7
 
+      - description: K3 AM62D2 SoC and Boards
+        items:
+          - enum:
+            - ti,am62d2-evm
+          - const: ti,am62d2
+
       - description: K3 AM62P5 SoC and Boards
         items:
           - enum:
-- 
2.34.1

On Thu, 01 May 2025 12:59:21 +0530, Paresh Bhagat wrote:
> The AM62D2 SoC belongs to the K3 Multicore SoC architecture with DSP core
> targeted for applications needing high-performance Digital Signal
> Processing. It is used in applications like automotive audio systems,
> professional sound equipment, radar and radio for aerospace, sonar in
> marine devices, and ultrasound in medical imaging. It also supports
> precise signal analysis in test and measurement tools.
> 
> Some highlights of AM62D2 SoC are:
> 
> * Quad-Cortex-A53s (running up to 1.4GHz) in a single cluster.
>   Dual/Single core variants are provided in the same package to allow
>   HW compatible designs.
> * One Device manager Cortex-R5F for system power and resource management,
>   and one Cortex-R5F for Functional Safety or general-purpose usage.
> * DSP with Matrix Multiplication Accelerator(MMA) (up to 2 TOPS) based on
>   single core C7x.
> * 3x Multichannel Audio Serial Ports (McASP) Up to 4/6/16 Serial Data Pins
>   which can Transmit and Receive Clocks up to 50MHz, with multi-channel I2S
>   and TDM Audio inputs and outputs.
> * Integrated Giga-bit Ethernet switch supporting up to a total of two
>   external ports with TSN capable to enable audio networking features such
>   as, Ethernet Audio Video Bridging (eAVB) and Dante.
> * 9xUARTs, 5xSPI, 6xI2C, 2xUSB2, 3xCAN-FD, 3x eMMC and SD, OSPI memory
>   controller, 1x CSI-RX-4L for Camera, eCAP/eQEP, ePWM, among other
>   peripherals.
> * Dedicated Centralized Hardware Security Module with support for secure
>   boot, debug security and crypto acceleration and trusted execution
>   environment.
> * One 32 bit DDR Subsystem that supports LPDDR4, DDR4 memory types.
> * Low power mode support: Partial IO support for CAN/GPIO/UART wakeup.
> 
> This adds dt bindings for TI's AM62D2 family of devices.
> 
> More details about the SoCs can be found in the Technical Reference Manual:
> https://www.ti.com/lit/pdf/sprujd4
> 
> Signed-off-by: Paresh Bhagat <p-bhagat@ti.com>
> ---
>  Documentation/devicetree/bindings/arm/ti/k3.yaml | 6 ++++++
>  1 file changed, 6 insertions(+)
> 

My bot found errors running 'make dt_binding_check' on your patch:

yamllint warnings/errors:
./Documentation/devicetree/bindings/arm/ti/k3.yaml:37:13: [warning] wrong indentation: expected 14 but found 12 (indentation)

dtschema/dtc warnings/errors:

doc reference errors (make refcheckdocs):

See https://patchwork.ozlabs.org/project/devicetree-bindings/patch/20250501072923.1262414-2-p-bhagat@ti.com

The base for the series is generally the latest rc1. A different dependency
should be noted in *this* patch.

If you already ran 'make dt_binding_check' and didn't see the above
error(s), then make sure 'yamllint' is installed and dt-schema is up to
date:

pip3 install dtschema --upgrade

Please check and re-submit after running the above command yourself. Note
that DT_SCHEMA_FILES can be set to your schema file to speed up checking
your schema. However, it must be unset to test all examples with your schema.