The number of supported trip points was only limited by the driver
implementation at the time, which mapped each trip point defined in the
devicetree source file to a hardware trip point. An implementation that
does not have this limitation is possible; indeed, that is how the
driver works currently. Therefore, this information should be removed
from the bindings description, which are meant to be independent of
the details of the driver implementation.

Reviewed-by: Sam Protsenko <semen.protsenko@linaro.org>
Signed-off-by: Mateusz Majewski <m.majewski2@samsung.com>
---
v2 -> v3: reword the commit message to be easier to understand in
  context of dt-bindings.
v1 -> v2: remove an unnecessary sentence.

 .../devicetree/bindings/thermal/samsung,exynos-thermal.yaml | 6 +-----
 1 file changed, 1 insertion(+), 5 deletions(-)

diff --git a/Documentation/devicetree/bindings/thermal/samsung,exynos-thermal.yaml b/Documentation/devicetree/bindings/thermal/samsung,exynos-thermal.yaml
index b8c0bb7f4263..b85b4c420cd3 100644
--- a/Documentation/devicetree/bindings/thermal/samsung,exynos-thermal.yaml
+++ b/Documentation/devicetree/bindings/thermal/samsung,exynos-thermal.yaml
@@ -40,11 +40,7 @@ properties:
   interrupts:
     description: |
       The Exynos TMU supports generating interrupts when reaching given
-      temperature thresholds. Number of supported thermal trip points depends
-      on the SoC (only first trip points defined in DT will be configured)::
-       - most of SoC: 4
-       - samsung,exynos5433-tmu: 8
-       - samsung,exynos7-tmu: 8
+      temperature thresholds.
     maxItems: 1
 
   reg:
-- 
2.45.1

On Wed, 07 Aug 2024 10:48:25 +0200, Mateusz Majewski wrote:
> The number of supported trip points was only limited by the driver
> implementation at the time, which mapped each trip point defined in the
> devicetree source file to a hardware trip point. An implementation that
> does not have this limitation is possible; indeed, that is how the
> driver works currently. Therefore, this information should be removed
> from the bindings description, which are meant to be independent of
> the details of the driver implementation.
> 
> Reviewed-by: Sam Protsenko <semen.protsenko@linaro.org>
> Signed-off-by: Mateusz Majewski <m.majewski2@samsung.com>
> ---
> v2 -> v3: reword the commit message to be easier to understand in
>   context of dt-bindings.
> v1 -> v2: remove an unnecessary sentence.
> 
>  .../devicetree/bindings/thermal/samsung,exynos-thermal.yaml | 6 +-----
>  1 file changed, 1 insertion(+), 5 deletions(-)
> 

Reviewed-by: Rob Herring (Arm) <robh@kernel.org>

On 07/08/2024 10:48, Mateusz Majewski wrote:
> The number of supported trip points was only limited by the driver
> implementation at the time, which mapped each trip point defined in the
> devicetree source file to a hardware trip point. An implementation that
> does not have this limitation is possible; indeed, that is how the
> driver works currently. Therefore, this information should be removed
> from the bindings description, which are meant to be independent of
> the details of the driver implementation.
> 
> Reviewed-by: Sam Protsenko <semen.protsenko@linaro.org>
> Signed-off-by: Mateusz Majewski <m.majewski2@samsung.com>
> ---

Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>

Best regards,
Krzysztof