Cc: Maurice Ma <maurice.ma@intel.com>
Cc: Richard Thomaiyar <richard.marian.thomaiyar@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Jiewen Yao <jiewen.yao@intel.com>
---
IntelFsp2WrapperPkg/Readme.md | 7 +++++++
1 file changed, 7 insertions(+)
diff --git a/IntelFsp2WrapperPkg/Readme.md b/IntelFsp2WrapperPkg/Readme.md
new file mode 100644
index 0000000..0b0f81b
--- /dev/null
+++ b/IntelFsp2WrapperPkg/Readme.md
@@ -0,0 +1,7 @@
+# IntelFsp2WrapperPkg
+
+This package provides the component to use an FSP binary.
+
+Source Repository: https://github.com/tianocore/edk2/tree/master/IntelFsp2WrapperPkg
+
+A whitepaper to describe the IntelFsp2WrapperPkg: https://firmware.intel.com/sites/default/files/A_Tour_Beyond_BIOS_Using_the_Intel_Firmware_Support_Package_with_the_EFI_Developer_Kit_II_%28FSP2.0%29.pdf
\ No newline at end of file
--
2.7.4.windows.1
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