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Signed-off-by: Dipa Ramesh Mantre --- drivers/remoteproc/qcom_q6v5_pas.c | 3 +++ 1 file changed, 3 insertions(+) diff --git a/drivers/remoteproc/qcom_q6v5_pas.c b/drivers/remoteproc/qcom_q= 6v5_pas.c index 60a4337d9e51..aa2add77b832 100644 --- a/drivers/remoteproc/qcom_q6v5_pas.c +++ b/drivers/remoteproc/qcom_q6v5_pas.c @@ -1537,6 +1537,9 @@ static const struct qcom_pas_data shikra_cdsp_resourc= e =3D { .sysmon_name =3D "cdsp", .ssctl_id =3D 0x17, .smem_host_id =3D 5, + .tmd_instance_id =3D 0x43, + .tmd_name =3D cdsp_tmd_name, + .num_tmd =3D ARRAY_SIZE(cdsp_tmd_name), }; =20 static const struct qcom_pas_data shikra_lpaicp_resource =3D { --=20 2.34.1 From nobody Sat Jul 25 20:04:27 2026 Received: from mx0a-0031df01.pphosted.com (mx0a-0031df01.pphosted.com [205.220.168.131]) (using TLSv1.2 with cipher ECDHE-RSA-AES256-GCM-SHA384 (256/256 bits)) (No client certificate requested) by smtp.subspace.kernel.org (Postfix) with ESMTPS id B7DB8281525; Tue, 14 Jul 2026 06:00:39 +0000 (UTC) Authentication-Results: smtp.subspace.kernel.org; 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Tue, 14 Jul 2026 11:30:32 +0530 (+0530) From: Dipa Ramesh Mantre Date: Tue, 14 Jul 2026 11:30:18 +0530 Subject: [PATCH 2/2] arm64: dts: qcom: shikra: Enable CDSP cooling Precedence: bulk X-Mailing-List: linux-kernel@vger.kernel.org List-Id: List-Subscribe: List-Unsubscribe: MIME-Version: 1.0 Content-Type: text/plain; charset="utf-8" Content-Transfer-Encoding: quoted-printable Message-Id: <20260714-shikra-cdsp-v1-2-8402e060809e@oss.qualcomm.com> References: <20260714-shikra-cdsp-v1-0-8402e060809e@oss.qualcomm.com> In-Reply-To: <20260714-shikra-cdsp-v1-0-8402e060809e@oss.qualcomm.com> To: Bjorn Andersson , Mathieu Poirier , Konrad Dybcio , Rob Herring , Krzysztof Kozlowski , Conor Dooley Cc: linux-arm-msm@vger.kernel.org, linux-remoteproc@vger.kernel.org, linux-kernel@vger.kernel.org, devicetree@vger.kernel.org, gaurav.kohli@oss.qualcomm.com, Dipa Ramesh Mantre X-Mailer: b4 0.14.3 X-Developer-Signature: v=1; a=ed25519-sha256; t=1784008832; l=1925; i=dipa.mantre@oss.qualcomm.com; s=20260415; 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Set up CDSP cooling by throttling the cdsp, when it reaches 115=C2=B0C. Signed-off-by: Dipa Ramesh Mantre --- arch/arm64/boot/dts/qcom/shikra.dtsi | 21 ++++++++++++++++++++- 1 file changed, 20 insertions(+), 1 deletion(-) diff --git a/arch/arm64/boot/dts/qcom/shikra.dtsi b/arch/arm64/boot/dts/qco= m/shikra.dtsi index 2ab474f18af7..d54ac6ed6ab7 100644 --- a/arch/arm64/boot/dts/qcom/shikra.dtsi +++ b/arch/arm64/boot/dts/qcom/shikra.dtsi @@ -10,6 +10,7 @@ #include #include #include +#include #include #include #include @@ -1898,6 +1899,8 @@ remoteproc_cdsp: remoteproc@b300000 { qcom,smem-states =3D <&cdsp_smp2p_out 0>; qcom,smem-state-names =3D "stop"; =20 + #cooling-cells =3D <3>; + status =3D "disabled"; =20 glink-edge { @@ -2401,6 +2404,8 @@ gpuss-critical { }; =20 nsp-thermal { + polling-delay-passive =3D <200>; + thermal-sensors =3D <&tsens0 7>; =20 trips { @@ -2410,12 +2415,26 @@ trip-point0 { type =3D "hot"; }; =20 - nsp-critical { + nsp_alert1: nsp-alert1 { temperature =3D <115000>; + hysteresis =3D <5000>; + type =3D "passive"; + }; + + nsp-critical { + temperature =3D <118000>; hysteresis =3D <0>; type =3D "critical"; }; }; + + cooling-maps { + map0 { + trip =3D <&nsp_alert1>; + cooling-device =3D <&remoteproc_cdsp QCOM_CDSP_TMD_CDSP_SW + THERMAL_NO_LIMIT THERMAL_NO_LIMIT>; + }; + }; }; =20 mdmss0-thermal { --=20 2.34.1