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[1.170.184.71]) by smtp.gmail.com with ESMTPSA id d2e1a72fcca58-83f19c7f202sm9105162b3a.43.2026.05.16.09.40.36 (version=TLS1_3 cipher=TLS_AES_256_GCM_SHA384 bits=256/256); Sat, 16 May 2026 09:40:38 -0700 (PDT) From: Chen-Shi-Hong To: linux@roeck-us.net Cc: corbet@lwn.net, skhan@linuxfoundation.org, linux-hwmon@vger.kernel.org, linux-doc@vger.kernel.org, linux-kernel@vger.kernel.org, Chen-Shi-Hong Subject: [PATCH v2] Documentation: hwmon: lm75: document sysfs interface Date: Sun, 17 May 2026 00:40:19 +0800 Message-ID: <20260516164022.1792-1-eric039eric@gmail.com> X-Mailer: git-send-email 2.53.0 In-Reply-To: <20260516160823.1461-1-eric039eric@gmail.com> References: <20260516160823.1461-1-eric039eric@gmail.com> Precedence: bulk X-Mailing-List: linux-kernel@vger.kernel.org List-Id: List-Subscribe: List-Unsubscribe: MIME-Version: 1.0 Content-Transfer-Encoding: quoted-printable Content-Type: text/plain; charset="utf-8" Document the sysfs attributes supported by the lm75 driver. The driver exposes temp1_input, temp1_max, temp1_max_hyst, and the standard update_interval attribute. Some chips also expose temp1_alarm, and temp1_label is available if a label is provided for the device. Add a sysfs-Interface section to Documentation/hwmon/lm75.rst to describe the supported attributes and clarify that temp1_alarm, temp1_label, and the write permissions of update_interval depend on the chip. Signed-off-by: Chen-Shi-Hong --- Documentation/hwmon/lm75.rst | 25 +++++++++++++++++++++++++ 1 file changed, 25 insertions(+) diff --git a/Documentation/hwmon/lm75.rst b/Documentation/hwmon/lm75.rst index 4269da04508e..fa8ddcaa0c2b 100644 --- a/Documentation/hwmon/lm75.rst +++ b/Documentation/hwmon/lm75.rst @@ -181,3 +181,28 @@ is supported by this driver, other specific enhancemen= ts are not. =20 The LM77 is not supported, contrary to what we pretended for a long time. Both chips are simply not compatible, value encoding differs. + +sysfs-Interface +--------------- + +=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D =3D=3D=3D=3D=3D=3D=3D=3D= =3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D= =3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D +temp1_input temperature input +temp1_max maximum temperature +temp1_max_hyst maximum temperature hysteresis +=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D =3D=3D=3D=3D=3D=3D=3D=3D= =3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D= =3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D + +If a label is provided for the device, the following attribute is also +available: + +=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D =3D=3D=3D=3D=3D=3D=3D=3D= =3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D= =3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D +temp1_label temperature channel label +=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D =3D=3D=3D=3D=3D=3D=3D=3D= =3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D= =3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D + +If supported by the chip, the following attribute is also available: + +=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D =3D=3D=3D=3D=3D=3D=3D=3D= =3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D= =3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D +temp1_alarm temperature alarm +=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D =3D=3D=3D=3D=3D=3D=3D=3D= =3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D= =3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D + +The standard update_interval attribute is also supported. Its write +permissions depend on the chip. --=20 2.53.0