From nobody Mon Feb 9 07:05:14 2026 Delivered-To: importer@patchew.org Received-SPF: pass (zohomail.com: domain of groups.io designates 66.175.222.12 as permitted sender) client-ip=66.175.222.12; envelope-from=bounce+27952+51419+1787277+3901457@groups.io; helo=web01.groups.io; Authentication-Results: mx.zohomail.com; dkim=pass; spf=pass (zohomail.com: domain of groups.io designates 66.175.222.12 as permitted sender) smtp.mailfrom=bounce+27952+51419+1787277+3901457@groups.io; dmarc=fail(p=none dis=none) header.from=intel.com ARC-Seal: i=1; a=rsa-sha256; t=1574903309; cv=none; d=zohomail.com; s=zohoarc; b=EKFamZJL/OVbMg1d48RD9mv6tYcKYb7MMCt/NND+GAf+mbQW39yFiMk2jcnb3xDCHI4YvbFpYD93Qc5oAAVfdRZARy9+PHLPpDDfD5Qyy7KtJAtG8SrASukuKZDnKEhU36fbwGEf1QbviLAlWDYLBMLanhYP3+iQqADbPpL9+24= ARC-Message-Signature: i=1; a=rsa-sha256; c=relaxed/relaxed; d=zohomail.com; s=zohoarc; t=1574903309; h=Cc:Date:From:In-Reply-To:List-Id:List-Unsubscribe:Message-ID:Reply-To:References:Sender:Subject:To; bh=lPgdVHf6gN4X+fsP3D1I9rGER9PcXU4KI4MuIqrqw1s=; b=ik9ThZ8NvpnMbi2zx5XeMZ4YLJo6p6blpWI/bApIFFbZadXNbuXUS7joiJN/FaGqYc7rc5tbMEqwLB71flB8Drbba1eSXD+Fyub4xVdGUZ2mC57wAc13BZqdI0QM25WJx8rhwfGamhKaVn48Ve5frfBpNgYKsjYpjlPH4tqjyxs= ARC-Authentication-Results: i=1; mx.zohomail.com; dkim=pass; spf=pass (zohomail.com: domain of groups.io designates 66.175.222.12 as permitted sender) smtp.mailfrom=bounce+27952+51419+1787277+3901457@groups.io; dmarc=fail header.from= (p=none dis=none) header.from= Received: from web01.groups.io (web01.groups.io [66.175.222.12]) by mx.zohomail.com with SMTPS id 15749033092916.103236029761433; Wed, 27 Nov 2019 17:08:29 -0800 (PST) Return-Path: X-Received: by 127.0.0.2 with SMTP id cFVOYY1788612xf5yhDFvQyi; Wed, 27 Nov 2019 17:08:28 -0800 X-Received: from mga02.intel.com (mga02.intel.com []) by mx.groups.io with SMTP id smtpd.web09.956.1574903281826413616 for ; Wed, 27 Nov 2019 17:08:28 -0800 X-Amp-Result: SKIPPED(no attachment in message) X-Amp-File-Uploaded: False X-Received: from orsmga005.jf.intel.com ([10.7.209.41]) by orsmga101.jf.intel.com with ESMTP/TLS/DHE-RSA-AES256-GCM-SHA384; 27 Nov 2019 17:08:27 -0800 X-ExtLoop1: 1 X-IronPort-AV: E=Sophos;i="5.69,251,1571727600"; d="scan'208";a="383668072" X-Received: from makuback-desk1.amr.corp.intel.com ([10.7.159.162]) by orsmga005.jf.intel.com with ESMTP; 27 Nov 2019 17:08:27 -0800 From: "Kubacki, Michael A" To: devel@edk2.groups.io Cc: Dandan Bi , Sai Chaganty , Eric Dong , Nate DeSimone , Liming Gao Subject: [edk2-devel] [edk2-platforms][PATCH V2 34/47] Platform/Intel/Readme.md Content update Date: Wed, 27 Nov 2019 17:06:01 -0800 Message-Id: <20191128010614.43628-35-michael.a.kubacki@intel.com> In-Reply-To: <20191128010614.43628-1-michael.a.kubacki@intel.com> References: <20191128010614.43628-1-michael.a.kubacki@intel.com> Precedence: Bulk List-Unsubscribe: Sender: devel@edk2.groups.io List-Id: Mailing-List: list devel@edk2.groups.io; contact devel+owner@edk2.groups.io Reply-To: devel@edk2.groups.io,michael.a.kubacki@intel.com X-Gm-Message-State: EAE7INza0X3swsYhtpurAYBSx1787277AA= DKIM-Signature: v=1; a=rsa-sha256; c=relaxed/simple; d=groups.io; q=dns/txt; s=20140610; t=1574903308; bh=VHcAM9gxxNQmm134R1+IsmZkHxky/OmVL/eRpPnJGhU=; h=Cc:Date:From:Reply-To:Subject:To; b=t3YsEjniulBTpxfyem6K3c31RJ/FjYXPsRyw/Rj7KoVxEvTFaAlKqSZKn3Ye+O+/vE3 3PsWRDg5pyjo/LajT+3Mveqd4wKWcRf2CAsQYbEI9EWyygA1aGVJQ4ktEKm2wSiy/Rvn6 VAxWSoCxw7lgfFN/oNb0LctDJIMNLXaaXaU= X-ZohoMail-DKIM: pass (identity @groups.io) Content-Transfer-Encoding: quoted-printable MIME-Version: 1.0 Content-Type: text/plain; charset="utf-8" Updates the advanced feature location referenced in Readme.md to edk2-platforms/Features/Intel. Cc: Dandan Bi Cc: Sai Chaganty Cc: Eric Dong Cc: Nate DeSimone Cc: Liming Gao Signed-off-by: Michael Kubacki Reviewed-by: Nate DeSimone --- Platform/Intel/Readme.md | 14 +++++++------- 1 file changed, 7 insertions(+), 7 deletions(-) diff --git a/Platform/Intel/Readme.md b/Platform/Intel/Readme.md index 0f86978fee..02d9517d19 100644 --- a/Platform/Intel/Readme.md +++ b/Platform/Intel/Readme.md @@ -89,8 +89,7 @@ A UEFI firmware implementation using MinPlatformPkg is co= nstructed using the fol The board package follows the standard EDK II package structure with the f= ollowing additional elements and guidelines: * Only code usable across more than one board at the root level. * Board-specific code in a directory. The directory name should match that= of the board supported. -* Features not essential to achieve stage 5 or earlier boots are maintaine= d in a Features folder at the appropriate - level in the package hierarchy. +* Features not essential to achieve stage 5 or earlier boots are maintaine= d in edk2-platforms/Features/Intel. =20 Shared resources in the package root directory can include interfaces desc= ribed in header files, library instances, firmware modules, binaries, etc. The UEFI firmware implementation is built= using the process described below from the @@ -260,16 +259,17 @@ return back to the minimum platform caller. =20 ### **Package Builds** =20 -In some cases, such as AdvancedFeaturePkg, a package may provide a set of = functionality that is included in other +In some cases, such as BoardModulePkg, a package may provide a set of func= tionality that is included in other packages. To test the build of the whole package, the "build" command shou= ld be used following the instructions below. =20 1. Execute edksetup.bat (Windows) or edksetup.sh (Linux). 2. Verify the "WORKSPACE" environment variable is set to the edk2 director= y in your workspace. -3. Set the "PACKAGES_PATH" environment variable to include the edk2-platfo= rms/Platform/Intel and edk2-platforms/Silicon/Intel - directories. - * Windows example: set PACKAGES_PATH=3Dc:\Edk2Workspace\edk2-platforms\= Platform\Intel;c:\Edk2Workspace\edk2-platforms\Silicon\Intel +3. Set the "PACKAGES_PATH" environment variable to include the edk2-platfo= rms/Platform/Intel, edk2-platforms/Silicon/Intel, + and edk2-platforms/Features/Intel directories. + * Windows example: set PACKAGES_PATH=3Dc:\Edk2Workspace\edk2-platforms\= Platform\Intel; + c:\Edk2Workspace\edk2-platforms\Silicon\Intel;c:\Edk2Workspace\edk2-p= latforms\Features\Intel 4. Build the package by specifying the package DSC as the platform build t= arget from the Platform/Intel or Silicon/Intel directory: - "build -p AdvancedFeaturePkg/AdvancedFeaturePkg.dsc" + "build -p BoardModulePkg/BoardModulePkg.dsc -a IA32 -a X64" =20 =20 ### **Firmware Image Flashing** --=20 2.16.2.windows.1 -=3D-=3D-=3D-=3D-=3D-=3D-=3D-=3D-=3D-=3D-=3D- Groups.io Links: You receive all messages sent to this group. View/Reply Online (#51419): https://edk2.groups.io/g/devel/message/51419 Mute This Topic: https://groups.io/mt/63459961/1787277 Group Owner: devel+owner@edk2.groups.io Unsubscribe: https://edk2.groups.io/g/devel/unsub [importer@patchew.org] -=3D-=3D-=3D-=3D-=3D-=3D-=3D-=3D-=3D-=3D-=3D-