From nobody Sun Feb 8 12:39:07 2026 Delivered-To: importer@patchew.org Received-SPF: pass (zoho.com: domain of groups.io designates 66.175.222.12 as permitted sender) client-ip=66.175.222.12; envelope-from=bounce+27952+41462+1787277+3901457@groups.io; helo=web01.groups.io; Authentication-Results: mx.zohomail.com; dkim=pass; spf=pass (zoho.com: domain of groups.io designates 66.175.222.12 as permitted sender) smtp.mailfrom=bounce+27952+41462+1787277+3901457@groups.io; dmarc=fail(p=none dis=none) header.from=intel.com ARC-Seal: i=1; a=rsa-sha256; t=1559031110; cv=none; d=zoho.com; s=zohoarc; b=oXyHfib6izHsoX+QbYAo8yFF8sUtCHdUsF6PZFj3+U0zl8HvHLKjT4wB/6YhYt7rUyxMCcXjdz2GLohPuooYwoF3Owq5PyVQO2wawx30GGdaejg6v44qDvV8e9lG0553bZroFcOsdFOWi5+XLSyxg/fkSlK2lOeaPzu1lNp79H0= ARC-Message-Signature: i=1; a=rsa-sha256; c=relaxed/relaxed; d=zoho.com; s=zohoarc; t=1559031110; h=Content-Transfer-Encoding:Cc:Date:From:In-Reply-To:List-Id:List-Unsubscribe:MIME-Version:Message-ID:Reply-To:References:Sender:Subject:To:ARC-Authentication-Results; bh=f98tcW6nVHR3lpvBM2HZNdmLnSlQ+GJ1VE4kHIB7kYg=; b=ISJFDIC5MuuiZuPsEjRB3s7lW18AKhrIBgdJe8gsm2cliwnbgSwXuL4XVonEPlISPuyn8LK5n7adPcTeN043aj6ThzwunHAQ64K5okE4Vy4KBnSdIjozDd7Js8tUQMo38JWXnm1m46YoVZytWBj1UkPSNymIpkVA2VVPVVq6HIQ= ARC-Authentication-Results: i=1; mx.zoho.com; dkim=pass; spf=pass (zoho.com: domain of groups.io designates 66.175.222.12 as permitted sender) smtp.mailfrom=bounce+27952+41462+1787277+3901457@groups.io; dmarc=fail header.from= (p=none dis=none) header.from= Received: from web01.groups.io (web01.groups.io [66.175.222.12]) by mx.zohomail.com with SMTPS id 1559031110225171.04446898745414; Tue, 28 May 2019 01:11:50 -0700 (PDT) Return-Path: X-Received: from mga11.intel.com (mga11.intel.com []) by groups.io with SMTP; Tue, 28 May 2019 01:11:49 -0700 X-Amp-Result: SKIPPED(no attachment in message) X-Amp-File-Uploaded: False X-Received: from orsmga007.jf.intel.com ([10.7.209.58]) by fmsmga102.fm.intel.com with ESMTP/TLS/DHE-RSA-AES256-GCM-SHA384; 28 May 2019 01:11:49 -0700 X-ExtLoop1: 1 X-Received: from ydong10-win10.ccr.corp.intel.com ([10.239.158.133]) by orsmga007.jf.intel.com with ESMTP; 28 May 2019 01:11:47 -0700 From: "Dong, Eric" To: devel@edk2.groups.io Cc: Liming Gao , Michael Kubacki , Sai Chaganty , Oram Isaac W Subject: [edk2-devel] [Patch v3 1/3] [edk2-platform] Maintainers.txt: Add BoardModulePkg in Platform/Intel/ folder. Date: Tue, 28 May 2019 16:11:43 +0800 Message-Id: <20190528081145.10008-2-eric.dong@intel.com> In-Reply-To: <20190528081145.10008-1-eric.dong@intel.com> References: <20190528081145.10008-1-eric.dong@intel.com> MIME-Version: 1.0 Precedence: Bulk List-Unsubscribe: Sender: devel@edk2.groups.io List-Id: Mailing-List: list devel@edk2.groups.io; contact devel+owner@edk2.groups.io Reply-To: devel@edk2.groups.io,eric.dong@intel.com Content-Transfer-Encoding: quoted-printable DKIM-Signature: v=1; a=rsa-sha256; c=relaxed/simple; d=groups.io; q=dns/txt; s=20140610; t=1559031109; bh=t8TdeTgAPBrHyksygDRWVsnICH/Hp7Wuuq6VZyfZ+iI=; h=Cc:Date:From:Reply-To:Subject:To; b=Cq6t/RPPGz8xP/8KGw76aT0dcVEDiMWKa2ljQP4Ai955kCUI/zdsxf0vDJP2Az2bUjJ SceDUs+cgJxpnH5+2Aw9HDHFP4OUNNE/e9W1hjMaVxj+0TLf83BMRnwpKFUIraat3BQ05 6l+2K/T2umWcwpUUjxwoGK3Km5Q1vC/bKW0= X-ZohoMail-DKIM: pass (identity @groups.io) Content-Type: text/plain; charset="utf-8" V3 change: 1. Fix file path typo. V2 change: Add package DSC file to enable package build. V1 change: Add new package BoardModulePkg which used to keep the modules which is generic for all board. Signed-off-by: Eric Dong Cc: Liming Gao Cc: Michael Kubacki Cc: Sai Chaganty Cc: Oram Isaac W --- Maintainers.txt | 4 + .../Intel/BoardModulePkg/BoardModulePkg.dec | 26 +++++++ .../Intel/BoardModulePkg/BoardModulePkg.dsc | 74 +++++++++++++++++++ 3 files changed, 104 insertions(+) create mode 100644 Platform/Intel/BoardModulePkg/BoardModulePkg.dec create mode 100644 Platform/Intel/BoardModulePkg/BoardModulePkg.dsc diff --git a/Maintainers.txt b/Maintainers.txt index 76feecceb7..2bc4a6c1ca 100644 --- a/Maintainers.txt +++ b/Maintainers.txt @@ -60,6 +60,10 @@ M: Michael Kubacki M: Sai Chaganty R: Liming Gao =20 +Platform/Intel/BoardModulePkg +M: Eric Dong +R: Liming Gao + Platform/Intel/ClevoOpenBoardPkg M: Michael Kubacki M: Ankit Sinha diff --git a/Platform/Intel/BoardModulePkg/BoardModulePkg.dec b/Platform/In= tel/BoardModulePkg/BoardModulePkg.dec new file mode 100644 index 0000000000..94de8989c4 --- /dev/null +++ b/Platform/Intel/BoardModulePkg/BoardModulePkg.dec @@ -0,0 +1,26 @@ +## @file +# This package provides the modules that build for a full feature platform. +# This AdvancedFeaturePkg should only depend on EDKII Core packages and Mi= nPlatformPkg. +# +# The DEC files are used by the utilities that parse DSC and +# INF files to generate AutoGen.c and AutoGen.h files +# for the build infrastructure. +# +# Copyright (c) 2019, Intel Corporation. All rights reserved.
+# +# SPDX-License-Identifier: BSD-2-Clause-Patent +# +## + + +[Defines] + DEC_SPECIFICATION =3D 0x00010017 + PACKAGE_NAME =3D BoardModulePkg + PACKAGE_VERSION =3D 0.1 + PACKAGE_GUID =3D 30EEB750-574D-45AA-8895-D77161019BC7 + + +[Includes] + + +[LibraryClasses] diff --git a/Platform/Intel/BoardModulePkg/BoardModulePkg.dsc b/Platform/In= tel/BoardModulePkg/BoardModulePkg.dsc new file mode 100644 index 0000000000..905fa13b35 --- /dev/null +++ b/Platform/Intel/BoardModulePkg/BoardModulePkg.dsc @@ -0,0 +1,74 @@ +## @file +# This package provides the modules that build for a full feature platform. +# This AdvancedFeaturePkg should only depend on EDKII Core packages and Mi= nPlatformPkg. +# +# The DEC files are used by the utilities that parse DSC and +# INF files to generate AutoGen.c and AutoGen.h files +# for the build infrastructure. +# +# Copyright (c) 2019, Intel Corporation. All rights reserved.
+# +# SPDX-License-Identifier: BSD-2-Clause-Patent +# +## + +[Defines] + PLATFORM_NAME =3D BoardModulePkg + PLATFORM_GUID =3D D36FD4CC-6CD1-4CE6-AA0B-EDB469DAE48B + PLATFORM_VERSION =3D 0.1 + DSC_SPECIFICATION =3D 0x00010005 + OUTPUT_DIRECTORY =3D Build/BoardModulePkg + SUPPORTED_ARCHITECTURES =3D IA32|X64 + BUILD_TARGETS =3D DEBUG|RELEASE|NOOPT + SKUID_IDENTIFIER =3D DEFAULT + +[LibraryClasses] + BaseLib|MdePkg/Library/BaseLib/BaseLib.inf + BaseMemoryLib|MdePkg/Library/BaseMemoryLib/BaseMemoryLib.inf + PrintLib|MdePkg/Library/BasePrintLib/BasePrintLib.inf + PeiServicesLib|MdePkg/Library/PeiServicesLib/PeiServicesLib.inf + UefiBootServicesTableLib|MdePkg/Library/UefiBootServicesTableLib/UefiBoo= tServicesTableLib.inf + DxeServicesLib|MdePkg/Library/DxeServicesLib/DxeServicesLib.inf + PcdLib|MdePkg/Library/BasePcdLibNull/BasePcdLibNull.inf + DebugLib|MdePkg/Library/BaseDebugLibNull/BaseDebugLibNull.inf + +[LibraryClasses.common.PEIM] + HobLib|MdePkg/Library/PeiHobLib/PeiHobLib.inf + MemoryAllocationLib|MdePkg/Library/PeiMemoryAllocationLib/PeiMemoryAlloc= ationLib.inf + +[LibraryClasses.IA32.PEIM, LibraryClasses.X64.PEIM] + PeiServicesTablePointerLib|MdePkg/Library/PeiServicesTablePointerLibIdt/= PeiServicesTablePointerLibIdt.inf + +[LibraryClasses.common.DXE_DRIVER] + HobLib|MdePkg/Library/DxeHobLib/DxeHobLib.inf + MemoryAllocationLib|MdePkg/Library/UefiMemoryAllocationLib/UefiMemoryAll= ocationLib.inf + +[LibraryClasses.common.UEFI_DRIVER] + HobLib|MdePkg/Library/DxeHobLib/DxeHobLib.inf + MemoryAllocationLib|MdePkg/Library/UefiMemoryAllocationLib/UefiMemoryAll= ocationLib.inf + +[LibraryClasses.common.DXE_RUNTIME_DRIVER] + HobLib|MdePkg/Library/DxeHobLib/DxeHobLib.inf + MemoryAllocationLib|MdePkg/Library/UefiMemoryAllocationLib/UefiMemoryAll= ocationLib.inf + +##########################################################################= ######################### +# +# Components Section - list of the modules and components that will be pro= cessed by compilation +# tools and the EDK II tools to generate PE32/PE32+/C= off image files. +# +# Note: The EDK II DSC file is not used to specify how compiled binary ima= ges get placed +# into firmware volume images. This section is just a list of module= s to compile from +# source into UEFI-compliant binaries. +# It is the FDF file that contains information on combining binary f= iles into firmware +# volume images, whose concept is beyond UEFI and is described in PI= specification. +# Binary modules do not need to be listed in this section, as they s= hould be +# specified in the FDF file. For example: Shell binary (Shell_Full.e= fi), FAT binary (Fat.efi), +# Logo (Logo.bmp), and etc. +# There may also be modules listed in this section that are not requ= ired in the FDF file, +# When a module listed here is excluded from FDF file, then UEFI-com= pliant binary will be +# generated for it, but the binary will not be put into any firmware= volume. +# +##########################################################################= ######################### + +[Components] + --=20 2.21.0.windows.1 -=3D-=3D-=3D-=3D-=3D-=3D-=3D-=3D-=3D-=3D-=3D- Groups.io Links: You receive all messages sent to this group. View/Reply Online (#41462): https://edk2.groups.io/g/devel/message/41462 Mute This Topic: https://groups.io/mt/31819525/1787277 Group Owner: devel+owner@edk2.groups.io Unsubscribe: https://edk2.groups.io/g/devel/unsub [importer@patchew.org] -=3D-=3D-=3D-=3D-=3D-=3D-=3D-=3D-=3D-=3D-=3D-