From nobody Tue Apr 30 10:15:22 2024 Delivered-To: importer@patchew.org Received-SPF: none (zoho.com: 198.145.21.10 is neither permitted nor denied by domain of lists.01.org) client-ip=198.145.21.10; envelope-from=edk2-devel-bounces@lists.01.org; helo=ml01.01.org; Authentication-Results: mx.zoho.com; spf=none (zoho.com: 198.145.21.10 is neither permitted nor denied by domain of lists.01.org) smtp.mailfrom=edk2-devel-bounces@lists.01.org; Return-Path: Received: from ml01.01.org (ml01.01.org [198.145.21.10]) by mx.zohomail.com with SMTPS id 1498100172139201.07282048541072; Wed, 21 Jun 2017 19:56:12 -0700 (PDT) Received: from [127.0.0.1] (localhost [IPv6:::1]) by ml01.01.org (Postfix) with ESMTP id 659E421C8F63B; Wed, 21 Jun 2017 19:54:45 -0700 (PDT) Received: from mga02.intel.com (mga02.intel.com [134.134.136.20]) (using TLSv1.2 with cipher ECDHE-RSA-AES256-GCM-SHA384 (256/256 bits)) (No client certificate requested) by ml01.01.org (Postfix) with ESMTPS id 6177F21C8F634 for ; Wed, 21 Jun 2017 19:54:43 -0700 (PDT) Received: from fmsmga006.fm.intel.com ([10.253.24.20]) by orsmga101.jf.intel.com with ESMTP/TLS/DHE-RSA-AES256-GCM-SHA384; 21 Jun 2017 19:56:07 -0700 Received: from shwdeopenpsi014.ccr.corp.intel.com ([10.239.9.13]) by fmsmga006.fm.intel.com with ESMTP; 21 Jun 2017 19:56:06 -0700 X-Original-To: edk2-devel@lists.01.org X-ExtLoop1: 1 X-IronPort-AV: E=Sophos;i="5.39,371,1493708400"; d="scan'208";a="117828932" From: Hao Wu To: edk2-devel@lists.01.org Date: Thu, 22 Jun 2017 10:56:04 +0800 Message-Id: <20170622025604.12228-1-hao.a.wu@intel.com> X-Mailer: git-send-email 2.12.0.windows.1 Subject: [edk2] [PATCH] IntelSiliconPkg: Add package DSC file X-BeenThere: edk2-devel@lists.01.org X-Mailman-Version: 2.1.22 Precedence: list List-Id: EDK II Development List-Unsubscribe: , List-Archive: List-Post: List-Help: List-Subscribe: , Cc: Hao Wu , Jiewen Yao MIME-Version: 1.0 Content-Transfer-Encoding: quoted-printable Errors-To: edk2-devel-bounces@lists.01.org Sender: "edk2-devel" X-ZohoMail: RSF_4 Z_629925259 SPT_0 Content-Type: text/plain; charset="utf-8" Cc: Jiewen Yao Contributed-under: TianoCore Contribution Agreement 1.0 Signed-off-by: Hao Wu Reviewed-by: Jiewen.yao@intel.com --- IntelSiliconPkg/IntelSiliconPkg.dsc | 46 +++++++++++++++++++++++++++++++++= ++++ 1 file changed, 46 insertions(+) create mode 100644 IntelSiliconPkg/IntelSiliconPkg.dsc diff --git a/IntelSiliconPkg/IntelSiliconPkg.dsc b/IntelSiliconPkg/IntelSil= iconPkg.dsc new file mode 100644 index 0000000000..f77f2a966e --- /dev/null +++ b/IntelSiliconPkg/IntelSiliconPkg.dsc @@ -0,0 +1,46 @@ +## @file +# This package provides common open source Intel silicon modules. +# +# Copyright (c) 2017, Intel Corporation. All rights reserved.
+# +# This program and the accompanying materials +# are licensed and made available under the terms and conditions of the= BSD License +# which accompanies this distribution. The full text of the license may= be found at +# http://opensource.org/licenses/bsd-license.php +# +# THE PROGRAM IS DISTRIBUTED UNDER THE BSD LICENSE ON AN "AS IS" BASIS, +# WITHOUT WARRANTIES OR REPRESENTATIONS OF ANY KIND, EITHER EXPRESS OR = IMPLIED. +# +## + +[Defines] + PLATFORM_NAME =3D IntelSiliconPkg + PLATFORM_GUID =3D 9B96228E-1155-4967-8E16-D0ED8E1B4297 + PLATFORM_VERSION =3D 0.1 + DSC_SPECIFICATION =3D 0x00010005 + OUTPUT_DIRECTORY =3D Build/IntelSiliconPkg + SUPPORTED_ARCHITECTURES =3D IA32|X64 + BUILD_TARGETS =3D DEBUG|RELEASE|NOOPT + SKUID_IDENTIFIER =3D DEFAULT + +##########################################################################= ######################### +# +# Components Section - list of the modules and components that will be pro= cessed by compilation +# tools and the EDK II tools to generate PE32/PE32+/C= off image files. +# +# Note: The EDK II DSC file is not used to specify how compiled binary ima= ges get placed +# into firmware volume images. This section is just a list of module= s to compile from +# source into UEFI-compliant binaries. +# It is the FDF file that contains information on combining binary f= iles into firmware +# volume images, whose concept is beyond UEFI and is described in PI= specification. +# Binary modules do not need to be listed in this section, as they s= hould be +# specified in the FDF file. For example: Shell binary (Shell_Full.e= fi), FAT binary (Fat.efi), +# Logo (Logo.bmp), and etc. +# There may also be modules listed in this section that are not requ= ired in the FDF file, +# When a module listed here is excluded from FDF file, then UEFI-com= pliant binary will be +# generated for it, but the binary will not be put into any firmware= volume. +# +##########################################################################= ######################### + +[Components] + IntelSiliconPkg/Library/DxeSmbiosDataHobLib/DxeSmbiosDataHobLib.inf --=20 2.12.0.windows.1 _______________________________________________ edk2-devel mailing list edk2-devel@lists.01.org https://lists.01.org/mailman/listinfo/edk2-devel